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2032348
Bonding Properties of Package-on-Package Stack Interconnection Using by 150 ㎛ Height Copper Posts
Mi-Song Kim, So-Hee Hyun, Joo Young Bae, Won Sik Hong
J Weld Join. 2024;42(4):378-387.   Published online August 31, 2024
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2032329
Thermal Cycling Performance of Heterogeneous Solder Ball Joints with Sn-3.0Ag-0.5Cu and Sn-0.75Cu(-Ni,Bi) Solder Ball Composition for BGA Package
Joo Young Bae, Mi-Song Kim, So-Hee Hyun et al.
J Weld Join. 2024;42(2):174-183.   Published online April 30, 2024
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Bonding Characteristics of Solder and Sinter Joints on Active-Metal-Brazing Substrates with Nano Sputtered Ag-Cu-Ti Brazing Filler Metal
Mi-Song Kim, Won Sik Hong, Yong-Mo Kim
J Weld Join. 2023;41(6):558-565.   Published online December 31, 2023
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Electrochemical Metallic Ion Migration Property of Multi-Layer Ceramic Capacitor for Car Electronics
Won Sik Hong, Mi-Song Kim, Joo Young Bae et al.
J Weld Join. 2023;41(6):519-527.   Published online December 31, 2023
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2032294
Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes
So-Hee Hyun, Hye Min Lee, Mi-Song Kim, Won Sik Hong
J Weld Join. 2023;41(5):387-395.   Published online October 31, 2023
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2032293
Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package
Joo Young Bae, Mi-Song Kim, Hye Min Lee et al.
J Weld Join. 2023;41(5):379-386.   Published online October 31, 2023
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2032281
Solder Joint Degradation and Electrochemical Metallic Ion Migration Property of Solder Joints with Surface Finish
Hye Min Lee, Mi-Song Kim, Won Sik Hong
J Weld Join. 2023;41(4):265-274.   Published online August 31, 2023
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2032222
Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints
Mi-Song Kim, Won Sik Hong, Hye-Min Lee, Myeongin Kim
J Weld Join. 2022;40(3):207-214.   Published online June 20, 2022
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2032224
Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test
Myeongin Kim, Won Sik Hong, Mi-Song Kim
J Weld Join. 2022;40(3):271-277.   Published online June 2, 2022
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Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong
J Weld Join. 2022;40(2):165-174.   Published online April 21, 2022
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Microstructural Evolution of Cantilever Wire Probe after Touch-Down Fatigue Cycles for Power Semi-Conductor Wafer Testing
Won Sik Hong, Mi-Song Kim, Myeongin Kim
J Weld Join. 2021;39(6):677-683.   Published online December 6, 2021
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2032166
Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing
Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park
J Weld Join. 2021;39(4):368-375.   Published online August 26, 2021
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2032163
Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing
Mi-Song Kim, Won Sik Hong, Myeongin Kim
J Weld Join. 2021;39(4):359-367.   Published online August 23, 2021
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2032158
MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes
Won Sik Hong, Mi-Song KIm, Myeongin Kim
J Weld Join. 2021;39(4):349-358.   Published online August 11, 2021
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2032157
Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging
Mi-Song Kim, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, Jeong Tak Moon
J Weld Join. 2021;39(4):343-348.   Published online August 11, 2021
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