Advanced Search  
 JWJ Search

368 Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing   
Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park
Journal of Welding and Joining:368-375.  Publication Date (Web): August 26, 2021
                  PDF Links
 
359 Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing   
Mi-Song Kim, Won Sik Hong, Myeongin Kim
Journal of Welding and Joining:359-367.  Publication Date (Web): August 23, 2021
                  PDF Links
 
349 MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes   
Won Sik Hong, Mi-Song KIm, Myeongin Kim
Journal of Welding and Joining:349-358.  Publication Date (Web): August 11, 2021
                  PDF Links
 
343 Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging   
Mi-Song Kim, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, Jeong Tak Moon
Journal of Welding and Joining:343-348.  Publication Date (Web): August 11, 2021
                  PDF Links
 
15 Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module   
Mi-Song Kim, Chulmin Oh, Won Sik Hong
Journal of Welding and Joining:15-20.  Publication Date (Web): April 19, 2019   Cited by 4
                  PDF Links
 
21 Cu Corrosion Test Method for Lead-Free Solders   
Mi-Song Kim, Won Sik Hong, Chul Min Oh, Keun-Soo Kim
Journal of Welding and Joining:21-27.  Publication Date (Web): June 30, 2017
                  PDF Links
 
1 |
e-submission
endonote style file
JWJ
vol: Issue: Page:
e-sciencecentral
Register for e-submission
Register here to access the e-submission system of Journal of Welding and Joining for authors and reviewers.
Manuscript Submission
To submit a manuscript, please visit the Journal of Welding and Joining e-submission management system at https://submit.e-jwj.org, read the Instructions for Authors, and log into the Journal of Welding and Joining e-submission system. For assistance with manuscript submission, please contact: koweld@kwjs.or.kr.
Free archive
Anyone may access any past or current articles without logging in.
Editorial Office
#304, San-Jeong Building,
23, Gukhoe-daero 66-gil, Yeongdeungpo-gu, Seoul 07237, Korea
TEL : +82-2-538-6511    FAX : +82-2-538-6510   E-mail: koweld@kwjs.or.kr
Browse Articles |  Current Issue |  For Authors and Reviewers |  About
Copyright© by The Korean Welding and Joining Society.           Developed in M2PI