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Solder Joint Degradation and Electrochemical Metallic Ion Migration Property of Solder Joints with Surface Finish
Hye Min Lee, Mi-Song Kim, Won Sik Hong
J Weld Join. 2023;41(4):265-274. Published online 2023 Aug 31 DOI: https://doi.org/10.5781/JWJ.2023.41.4.5
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