 |
|
Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package
Joo Young Bae, Mi-Song Kim, Hye Min Lee, Seul Gi Lee, Young-Woo Lee, Jeong Tak Moon, Won Sik Hong
J Weld Join. 2023;41(5):379-386. Published online 2023 Oct 31 DOI: https://doi.org/10.5781/JWJ.2023.41.5.8
|
|
Citations to this article as recorded by
 Thermal Cycling Performance of Heterogeneous Solder Ball Joints with Sn-3.0Ag-0.5Cu and Sn-0.75Cu(-Ni,Bi) Solder Ball Composition for BGA Package
Joo Young Bae, Mi-Song Kim, So-Hee Hyun, Jong-Hyun Lee, Jeong Tak Moon, Young-Woo Lee, Seul Gi Lee, Hyeong-Tea Kim, Seung-Kwan Baek, Won Sik Hong
Journal of Welding and Joining.2024; 42(2): 174. CrossRef Solidification Behavior and Mechanical Properties of Sn-2.5Ag-0.8Cu-0.05Ni-1Bi and Sn-0.75Cu-0.065Ni-1.5Bi Solder Alloys, and Microstructures in Joints Formed Using Them
Hye-Min Lee, Jung Tak Moon, Young-Woo Lee, Hui Joong Kim, Seul Gi Lee, Joug-Hyun Lee
Korean Journal of Metals and Materials.2024; 62(7): 511. CrossRef Bonding Properties of Package-on-Package Stack Interconnection Using by 150 ㎛ Height Copper Posts
Mi-Song Kim, So-Hee Hyun, Joo Young Bae, Won Sik Hong
Journal of Welding and Joining.2024; 42(4): 378. CrossRef
|