Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing
Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park
J Weld Join. 2021;39(4):368-375.   Published online 2021 Aug 26     DOI: https://doi.org/10.5781/JWJ.2021.39.4.4
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Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test
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Journal of Welding and Joining.2022; 40(3): 271.     CrossRef
Microstructural Evolution of Cantilever Wire Probe after Touch-Down Fatigue Cycles for Power Semi-Conductor Wafer Testing
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Journal of Welding and Joining.2021; 39(6): 677.     CrossRef