 |
|
Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing
Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park
J Weld Join. 2021;39(4):368-375. Published online 2021 Aug 26 DOI: https://doi.org/10.5781/JWJ.2021.39.4.4
|
|
Citations to this article as recorded by
 Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test
Myeongin Kim, Won Sik Hong, Mi-Song Kim
Journal of Welding and Joining.2022; 40(3): 271. CrossRef Microstructural Evolution of Cantilever Wire Probe after Touch-Down Fatigue Cycles for Power Semi-Conductor Wafer Testing
Won Sik Hong, Mi-Song Kim, Myeongin Kim
Journal of Welding and Joining.2021; 39(6): 677. CrossRef
|