Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong
J Weld Join. 2022;40(2):165-174.   Published online 2022 Apr 21     DOI: https://doi.org/10.5781/JWJ.2022.40.2.8
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Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints
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Journal of Welding and Joining.2022; 40(3): 207.     CrossRef