Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints
Mi-Song Kim, Won Sik Hong, Hye-Min Lee, Myeongin Kim
J Weld Join. 2022;40(3):207-214.   Published online 2022 Jun 20     DOI: https://doi.org/10.5781/JWJ.2022.40.3.1
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Solder Joint Degradation and Electrochemical Metallic Ion Migration Property of Solder Joints with Surface Finish
Hye Min Lee, Mi-Song Kim, Won Sik Hong
Journal of Welding and Joining.2023; 41(4): 265.     CrossRef