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J Weld Join. 2022;40(3):271-277. Published online 2022 Jun 2 DOI: https://doi.org/10.5781/JWJ.2022.40.3.9
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Citations to this article as recorded by
 Thermal Cycling Performance of Heterogeneous Solder Ball Joints with Sn-3.0Ag-0.5Cu and Sn-0.75Cu(-Ni,Bi) Solder Ball Composition for BGA Package
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