Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging
Mi-Song Kim, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, Jeong Tak Moon
J Weld Join. 2021;39(4):343-348.   Published online 2021 Aug 11     DOI: https://doi.org/10.5781/JWJ.2021.39.4.1
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