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Recent Progress of TGV Technology for High Performance Semiconductor Packaging: Beom Chang Seok, Jae Pil Jung; J Weld Join. 2024;42(2):155-164. Published online April 30, 2024; DOI: https://doi.org/10.5781/JWJ.2024.42.2.2; PDF

Interfacial Properties of Sn-Cu-xCr Alloy using Laser-Assisted Bonding: Shin-Il Kim, Dong-Yurl Yu, Yun-Chan Kim, Junhyuk Son, Dongjin Byun, Junghwan Bang; J Weld Join. 2023;41(4):291-298. Published online August 31, 2023; DOI: https://doi.org/10.5781/JWJ.2023.41.4.8; Full text PubReader ePub PDF

Three-Dimesnional Semicondoctor Stacking using TSV(Through-Si-Via) Technology: Do Hoon Cho, Hye Jun Kang, Seong Min Seo, Jang Baeg Kim, Sri Harini Rajendran, Jae Pil Jung; J Weld Join. 2021;39(3):295-303. Published online May 17, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.3.8
Cited By 1; Full text PubReader ePub PDF

Fatigue Analysis of the Effects of Incomplete Penetration Defects on Fatigue Crack Initiation Points in Butt-Welded Members: Zhen-Ming Wang, Kyong-Ho Chang, Shazia Muzaffer; J Weld Join. 2020;38(6):543-550. Published online December 23, 2020; DOI: https://doi.org/10.5781/JWJ.2020.38.6.4
Cited By 5; Full text PubReader ePub PDF

Investigations of Material Properties of Underfill Material for Mechanical Reliability Improvement of Electronic Devices: Byung-Seung Yim, Jin-Nam Kim, Jong-Min Kim; J Weld Join. 2019;37(5):477-481. Published online September 19, 2019; DOI: https://doi.org/10.5781/JWJ.2019.37.5.7; Full text PubReader ePub PDF

Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module: Junhyuk Son, Minkyung Kim, Dong-Yurl Yu et al.; J Weld Join. 2017;35(5):38-47. Published online September 26, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.5.6
Cited By 9; Full text PubReader ePub PDF

Hot Wire Laser Welding of Multilayer for Narrow Gap - Analysis of Wire Melting/Transfer and Arc Formation Phenomenon by High Speed Imaging -: Kyounghak Kim, Hansur Bang, Heeseon Bang, Alexander F. H. Kaplan, Jonas Näsström, Jan Frostevarg; J Weld Join. 2016;34(5):26-32. Published online October 30, 2016; DOI: https://doi.org/10.5781/JWJ.2016.34.5.26; Full text PubReader ePub PDF

Technical Trend of TSV(Through Silicon Via) Filling for 3D Wafer Electric Packaging: Young-Ki Ko, Yong-Ho Ko, Jung-Hwan Bang, Chang-Woo Lee; J Weld Join. 2014;32(3):233-240. Published online June 30, 2014; DOI: https://doi.org/10.5781/JWJ.2014.32.3.19
Cited By 2; PDF

Fracture Mode Analysis with ISB Bonding Process Parameter for 3D Packaging: Young-Kang Lee , Jae-Hak Lee , Jun-Yeob Song , Hyoung-Joon Kim; J Weld Join. 2013;31(6):77-83. Published online January 21, 2014; DOI: https://doi.org/10.5781/KWJS.2013.31.6.77; PDF

Various Cu Filling Methods of TSV for Three Dimensional Packaging: Myong-Hoon Roh, Jun-Hyeong Lee, Wonjoong Kim, Jae Pil Jung, Hyeong-Tea Kim; J Weld Join. 2013;31(3):11-16. Published online June 30, 2013; DOI: https://doi.org/10.5781/KWJS.2013.31.3.11
Cited By 1; PDF

Interfacial Reaction and Joint Strength of the Sn-58Bi Solder Paste with ENIG Surface Finished Substrate: Hyun-Pil Shin, Byung-Wook Ahn, Jee-Hyuk Ahn et al.; J Weld Join. 2012;30(5):64-69. Published online November 30, 2012; DOI: https://doi.org/10.5781/KWJS.2012.30.5.64; PDF

Fabrication of Solder Bump Pattern Using Thin Mold: Dong-Jin Nam, Jae-Hak Lee, Choong-Don Yoo; J Weld Join. 2007;25(2):76-81. Published online May 17, 2007; PDF

Volume 42, No. 2

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

MOST VIEWED MOST CITED

7,586	Review on Vacuum Laser Beam Welding
4,063	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
3,810	Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
3,791	Study on Laser Welding of Dissimilar Materials between Aluminum and Copper (Ⅰ) - Research Trend in Laser Welding Technology and Materials Testing Methods -
3,680	Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles

Cited By 9	Changes in the Mechanical Properties and Microstructure of High Manganese Steel by High Heat Input Welding and General Welding Processes
Cited By 7	Review on Vacuum Laser Beam Welding
Cited By 6	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
Cited By 6	Comparison of Welding Deformation Characteristics by Circumferential Welding for Austenitic and Duplex Stainless Steel Pipe : Experimental Study
Cited By 6	Development and Evaluation of Stainless Steel-Base Flux-Cored Wires for 9% Nickel Steel

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