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Journal of KWJS 2007;25(2):76-81.
Published online May 17, 2007.
박판 몰드를 이용한 솔더 범프 패턴의 형성 공정
, ,
 
Fabrication of Solder Bump Pattern Using Thin Mold
Dong-Jin Nam, Jae-Hak Lee, Choong-Don Yoo
Abstract
  Solder bumps have been used to interconnect the chip and substrate, and the size of the solder bump decreases below 100㎛ to accommodate higher packaging density. In order to fabricate solder bumps, a mold?to?chip transfer process is suggested in this work. Since the thin stainless steel mold is not wet by the solder, the molten solder is forced to fill the mold cavities with ultrasonic vibration. The solders within the mold cavities are transferred to the Cu pads on the polyimide film through reflow soldering.
Key Words: Solder bump, Ultrasonic, Mold-to-chip transfer, Electronic packaging
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