Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee, Young-Bae Park, Junghwan Bang
J Weld Join. 2017;35(5):38-47. Published online 2017 Sep 26 DOI: https://doi.org/10.5781/JWJ.2017.35.5.6
|
Citations to this article as recorded by
Bonding Characteristics of Solder and Sinter Joints on Active-Metal-Brazing Substrates with Nano Sputtered Ag-Cu-Ti Brazing Filler Metal
Mi-Song Kim, Won Sik Hong, Yong-Mo Kim
Journal of Welding and Joining.2023; 41(6): 558. CrossRef Terminal Sinter-Bonding Using Silver Paste for Aluminum Nitride Heater
Yun-Chan Kim, Dong-Yurl Yu, Junhyuk Son, Ji-Sung KIm, Min-Su Kim, Chang-Woo Lee, Jai-Won Byeon, Junghwan Bang
Journal of Welding and Joining.2021; 39(4): 384. CrossRef A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste
Jeong-Won Yoon, Dong-Hwan Lee, Byung-Suk Lee
Journal of Welding and Joining.2021; 39(4): 376. CrossRef Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing
Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park
Journal of Welding and Joining.2021; 39(4): 368. CrossRef Interlayer Material Design Reducing Transient Liquid Phase Bonding Time
Sunghyun Sohn, Byungrok Moon, Junghoon Lee, Namhyun Kang, Younghoon Moon
Electronic Materials Letters.2020; 16(2): 106. CrossRef Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications
Byung-Suk Lee, Jong-Hoon Back, Jeong-Won Yoon
Journal of Welding and Joining.2019; 37(2): 26. CrossRef Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module
Mi-Song Kim, Chulmin Oh, Won Sik Hong
Journal of Welding and Joining.2019; 37(2): 15. CrossRef Pressureless transient liquid phase sintering bonding in air using Ni and Sn–58Bi for high-temperature packaging applications
Kyung Deuk Min, Kwang-Ho Jung, Choong-Jae Lee, Haksan Jeong, Seung-Boo Jung
Journal of Materials Science: Materials in Electro.2019; 30(20): 18848. CrossRef A Study on the Electrochemical Corrosion Property of Sn-xSb Solder Alloy
Junhyuk Son, Dong-Yurl Yu, Yong-Ho Ko, Junghwan Bang
Journal of Welding and Joining.2018; 36(3): 78. CrossRef
|