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- Friction Stir Spot Welding of Steel Alloy
- Chang-Yong Lee, Don-Hyun Choi, Yun-Mo Yeon, Won-Chan Seo, Seung-Boo Jung
- J Weld Join. 2008;26(6):12-17. Published online January 13, 2009
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- Reliability Evaluation of Electronic Circuit Printed Using Metallic Ink
- Ja-Myeong Koo, Jong-Bum Lee, Sang-Su Ha et al.
- J Weld Join. 2008;26(2):37-42. Published online June 18, 2008
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- Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging
- Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Bo-In Noh, Seung-Boo Jung
- J Weld Join. 2008;26(1):37-43. Published online March 21, 2008
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- Ultrasonic Bonding Technology for Flip Chip Packaging
- Ja-Myeong Koo, Jong-Woong Kim, Jeong-Won Yoon et al.
- J Weld Join. 2008;26(1):31-36. Published online March 21, 2008
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- Electrical Characterization of Electronic Package
- Jong-Woong Kim, Ja-Myeong Koo, Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
- J Weld Join. 2008;26(1):17-23. Published online March 21, 2008
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- Sn-Xwt%Cu계 솔더의 젖음성에 관한 연구Study on Wettability of Sn-Xwt%Cu Solder
- Bo-In Noh, Jeong-Won Yoon, Bui Quoc, Seung-Boo Jung
- J Weld Join. 2007;25(5):78-83. Published online January 28, 2008
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- Reliability Assessment for Electronic Assemblies with Electrical and Electrochemical Properties Measurement
- Won-Sik Hong, Chul-Min Oh, Noh-Chang Park, Byung-Suk Song, Seung-Boo Jung
- J Weld Join. 2007;25(2):16-23. Published online May 17, 2007
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- Flip-chip Bonding Technology and Reliability of Electronic Packaging
- Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo et al.
- J Weld Join. 2007;25(2):6-15. Published online May 17, 2007
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- Thermo-Mechanical Reliability of Lead-Free Surface Mount Assemblies for Auto-Mobile Application
- Sang-Su Ha, Jong-Woong Kim, Jong-Hyuck Chae et al.
- J Weld Join. 2006;24(6):21-27. Published online February 12, 2007
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- Fabrication of Through-hole Interconnect in Si Wafer for 3D Package
- Dae-Gon Kim, Jong-Woong Kim, Sang-Su Ha et al.
- J Weld Join. 2006;24(2):64-70. Published online July 18, 2006
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- Evaluation of Thermal Property and Fluidity with Underfill for BGA Package
- Bo-In Noh, Bo-Young Lee, Soo-Jung Kim, Seung-Boo Jung
- J Weld Join. 2006;24(2):57-63. Published online July 18, 2006
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- Application of MEMS Technology in Microelectronic Packaging
- Jong-Woong Kim, Dae-Gon Kim, Won-Chul Moon, Jeong-Hoon Moon, Chang-Chae Shur, Seung-Boo Jung
- J Weld Join. 2006;24(2):34-41. Published online July 18, 2006
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- [Research Papers] Joint Characteristics of Spot Friction Stir Welded A 5052 Alloy Sheet
- Yun-Mo Yeon, Won-Bae Lee, Chang-Yong Lee, Seung-Boo Jung, Keun Song
- J Weld Join. 2006;24(1):71-76. Published online April 3, 2006
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- Joint properties and Interface Analysis of Friction Stir Welded Dissimilar Materials between Austenite Stainless Steel and 6013 Al Alloy
- Won-Bae Lee, Gehard Biallas, Martin Schmuecker, Seung-Boo Jung
- J Weld Join. 2005;23(5):62-69. Published online November 11, 2005
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- Spot Friction Stir Welding and Characteristics of Joints in Aluminium Alloys
- Yun-Mo Yeon, Chang-Yong Lee, Won-Bae Lee, Seung-Boo Jung, Woong-Seong Chang
- J Weld Join. 2005;23(3):16-20. Published online July 15, 2005
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