Warning: fopen(/home/virtual/kwjs/journal/upload/ip_log/ip_log_2025-11.txt): failed to open stream: Permission denied in /home/virtual/lib/view_data.php on line 100 Warning: fwrite() expects parameter 1 to be resource, boolean given in /home/virtual/lib/view_data.php on line 101 Ultrasonic Bonding Technology for Flip Chip Packaging
  • Search
  • Advanced Search
Journal of KWJS 2008;26(1):31-36.
Published online March 21, 2008.
플립칩 패키징을 위한 초음파 접합 기술
, , , , , , ,
 
Ultrasonic Bonding Technology for Flip Chip Packaging
Ja-Myeong Koo, Jong-Woong Kim, Jeong-Won Yoon, Bo-In Noh, Chang-Yong Lee, Jeong-Hoon Moon, Choong-Don Yoo, Seung-Boo Jung
TOOLS
METRICS Graph View
  • 2,409 View
  • 0 Download
Related articles

Development of Bonding Process Technology for MLCB Electric Components2025 April;43(2)

Recent Progress of TGV Technology for High Performance Semiconductor Packaging2024 April;42(2)

Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles2022 June;40(3)

Latest Joining Technology of Metal and Plastic2016 June;34(3)

Design by Topology Optimization and Performance Test of Ultrasonic Bonding Module for Flip-Chip Packaging2012 December;30(6)

ABOUT
BROWSE ARTICLES
ARTICLE CATEGORY 
FOR CONTRIBUTORS
Editorial Office
#304, San-Jeong Building, 23, Gukhoe-daero 66-gil, Yeongdeungpo-gu, Seoul 07237, Korea
Tel: +82-2-538-6511    Fax: +82-2-538-6510    E-mail: koweld@kwjs.or.kr                

Copyright © 2025 by The Korean Welding and Joining Society.

Developed in M2PI