| Sn-Xwt%Cu계 솔더의 젖음성에 관한 연구Study on Wettability of Sn-Xwt%Cu Solder |
|
, , , |
| |
| Sn-Xwt%Cu계 솔더의 젖음성에 관한 연구Study on Wettability of Sn-Xwt%Cu Solder |
|
Bo-In Noh, Jeong-Won Yoon, Bui Quoc, Seung-Boo Jung |
|
|
| Abstract |
|
The wettability of Sn-Xwt%Cu(X=0～3wt%) solder was evaluated with wetting balance tester. And, the intermetallic compounds(IMCs) which were formed at the interface between solders and pads were investigated by using scanning electron microscopy(SEM) and energy dispersive spectroscopy(EDS). The wetting force of Sn-0.7wt%Cu solder was higher than that of 100wt%Sn and Sn-3.0wt%Cu solder. The value of γfl and (γfs -γls) had a tendency to increase with increasing the wetting temperature. The activation energy with bare Cu pad and flux with 15% solid content was increased in the following order: Sn-0.7Cu (68.42 kJ/㏖) ; Sn-3.0Cu(72.66 kJ/㏖) ; Sn solder(94.53 kJ/㏖). It was identified that the Cu6Sn5 phase was formed at the interface between Sn-Xwt%Cu solder and Cu pad. |
| Key Words:
Sn-Cu solder, Wettability, Activation energy, Intermetallic compound |
|
PDF Links
Full text via DOI
Download Citation
