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Journal of KWJS 2008;26(1):37-43.
Published online March 21, 2008.
Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging
Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Bo-In Noh, Seung-Boo Jung


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