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JWJ > Volume 25(2); 2007 > Article
Journal of KWJS 2007 April;25(2) :6-15.
Published online May 17, 2007.
Flip-chip Bonding Technology and Reliability of Electronic Packaging
Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Sang-Su Ha, Bo-In Noh, Won-Chul Moon, Jeong-Hoon Moon, Seung-Boo Jung







Correspondence:   Published online May 17, 2007
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