Flip-chip Bonding Technology and Reliability of Electronic Packaging

Journal of KWJS 2007;25(2):6-15.
Published online May 17, 2007.

전자 패키징의 플립칩 본딩 기술과 신뢰성

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Flip-chip Bonding Technology and Reliability of Electronic Packaging

Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Sang-Su Ha, Bo-In Noh, Won-Chul Moon, Jeong-Hoon Moon, Seung-Boo Jung

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