Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging

MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes

Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing

Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing

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343

Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging (Research Paper)

Mi-Song Kim, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, Jeong Tak Moon

Journal of Welding and Joining:343-348. Publication Date (Web): August 11, 2021 Cited by 1

DOI: https://doi.org/10.5781/JWJ.2021.39.4.1

349

MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes (Research Paper)

Won Sik Hong, Mi-Song KIm, Myeongin Kim

Journal of Welding and Joining:349-358. Publication Date (Web): August 11, 2021 Cited by 1

DOI: https://doi.org/10.5781/JWJ.2021.39.4.2

359

Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing (Research Paper)

Mi-Song Kim, Won Sik Hong, Myeongin Kim

Journal of Welding and Joining:359-367. Publication Date (Web): August 23, 2021 Cited by 1

DOI: https://doi.org/10.5781/JWJ.2021.39.4.3

368

Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing (Research Paper)

Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park

Journal of Welding and Joining:368-375. Publication Date (Web): August 26, 2021

DOI: https://doi.org/10.5781/JWJ.2021.39.4.4

376

A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste (Research Paper)

Jeong-Won Yoon, Dong-Hwan Lee, Byung-Suk Lee

Journal of Welding and Joining:376-383. Publication Date (Web): August 23, 2021 Cited by 1

DOI: https://doi.org/10.5781/JWJ.2021.39.4.5

384

Terminal Sinter-Bonding Using Silver Paste for Aluminum Nitride Heater (Research Paper)

Yun-Chan Kim, Dong-Yurl Yu, Junhyuk Son, Ji-Sung KIm, Min-Su Kim, Chang-Woo Lee, Jai-Won Byeon, Junghwan Bang

Journal of Welding and Joining:384-391. Publication Date (Web): August 27, 2021

DOI: https://doi.org/10.5781/JWJ.2021.39.4.6

392

Penetration Depth Modeling and Process Parameter Maps for Laser Welds Using Machine Learning (Research Paper)

Bum-su Go, Hyeonjeong You, Hee-seon Bang, Cheolhee Kim

Journal of Welding and Joining:392-401. Publication Date (Web): August 11, 2021 Cited by 1

DOI: https://doi.org/10.5781/JWJ.2021.39.4.7

402

Thermal Conductivity Measurement Method for the Thin Epoxy Adhesive Joint Layer (Research Paper)

Da-In Lim, So-Jeong Lee, Seung-Boo Jung, Jun-Ki Kim

Journal of Welding and Joining:402-408. Publication Date (Web): August 23, 2021

DOI: https://doi.org/10.5781/JWJ.2021.39.4.8

409

Thermal-induced Residual Stresses and Distortions in Friction Stir Welds - A Literature Review (Review Paper)

Mohamed H. El-Moayed, Ahmed Y. Shash, Mahmoud Abd Rabou, Mahmoud G. El-Sherbiny

Journal of Welding and Joining:409-418. Publication Date (Web): August 11, 2021

DOI: https://doi.org/10.5781/JWJ.2021.39.4.9

419

A Study on the Optimization of Welding Conditions for Titanium Drums Using GPS (Research Paper)

Won-Bin Oh, Ill-Soo Kim, Tae-Jong Yun, Bo-Ram Lee, Chung-Woo Lee, Bong-Yong Kang, Ji-Yeon Shim

Journal of Welding and Joining:419-426. Publication Date (Web): August 23, 2021 Cited by 1

DOI: https://doi.org/10.5781/JWJ.2021.39.4.10

427

Characteristic Analysis of Double Arcing on the Top Surface of STS304 in Plasma Arc Piercing (Research Paper)

Dong-Hyun Kim, Dae-Won Cho, Yeong-Kwan Jo, Jeong Suh, Kwang-Deok Choi, Ryoonhan Kim, Seokyoung Ahn

Journal of Welding and Joining:427-434. Publication Date (Web): August 23, 2021

DOI: https://doi.org/10.5781/JWJ.2021.39.4.11

435

Welding Distortion Prediction for Multi-Seam Welded Pipe Structures using Equivalent Thermal Strain Method (Research Paper)

Chunbiao Wu, Chao Wang, Jae-Woong Kim

Journal of Welding and Joining:435-444. Publication Date (Web): August 30, 2021 Cited by 1

DOI: https://doi.org/10.5781/JWJ.2021.39.4.12

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