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Research Paper

June 20, 2022


Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints
Mi-Song Kim, Won Sik Hong, Hye-Min Lee, et al.
J Weld Join. 2022;40(3):207-214.

In this study, the degradation characteristics of solder joints composed of powder-size Sn-3.0Ag-0.5Cu and the substrate surface finish are compared. Reflow is performed at a N2 ambient to apply an...

Review Paper

June 17, 2022


A Review of the Brazeability of Low-Temperature and Nano-Reinforced Al-Based Brazing Filler Metals
Furkan, Hye-Jeong Kim, Gun-hwan Lee, et al.
J Weld Join. 2022;40(3):216-224.

Aluminum and its alloys are some of the most widely used materials for the brazing of parts in aerospace and automotive industries due to their excellent physical characteristics, e.g., good...

Research Paper

June 24, 2022


Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with ENEPIG Surface Finish
Jieun Yu, Sujong Kim, Won Sik Hong, et al.
J Weld Join. 2022;40(3):225-232.

The equation for predicting the growth behavior of intermetallic compounds (IMC) by electromigration (EM) of the Cu/ENEPIG/Sn-2.5Ag/Cu solder joint was modeled, and the actual behavior observed through experiments and the...

Review Paper

June 2, 2022


Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles
Dong-Hwan Lee, Min-Haeng Heo, Jeong-Won Yoon
J Weld Join. 2022;40(3):233-241.

Recently, interest in power modules is increasing in eco-friendly mobility such as electric vehicles (EVs) and fuel cell electric vehicles (FCEVs). The power module is a key component of the...

Research Paper

June 14, 2022


Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers
Min Jeong Ha, Ji-Ho Kim, Jae-Goo Han, et al.
J Weld Join. 2022;40(3):242-247.

In this study, low-melting-point alloy (LMPA) and high-melting-point alloy (HMPA) filler-filled solderable polymer composite (LH-SPC) system was proposed to enhance the mechanical and thermal properties of SPC with LMPA fillers....

Research Paper

June 14, 2022


Deposition of a Porous Cu Layer by Electroplating and Feasibility Evaluation of Cu-Cu Die Attachment by Sinter Bonding Using Thermo-Compression
Doyeop Namgoong, Jong-Hyun Lee
J Weld Join. 2022;40(3):248-255.

A porous Cu layer was deposited on a dummy Cu die and a dummy substrate, respectively, by electroplating to form a bondline that can endure high temperatures, such as 300...

Research Paper

June 2, 2022


Study on Effect of Process Variable on Fastening Quality Using Process Monitoring Data of Flow Drill Screwed 590DP Steel/AA5052 combination
Tae-Young Kang, Han-ju Lee, Karim Md Abdul, et al.
J Weld Join. 2022;40(3):256-264.

The reduction of the weight of a vehicle body to improve fuel efficiency has been garnering widespread interest in the automobile industry. As the use of lighter materials increases, the...

Research Paper

June 2, 2022


FEA Simulation Based Power Adaption for Laser Welding of Radii
Johannes Gaigl
J Weld Join. 2022;40(3):265-270.

This paper describes an investigation on laser-MIG hybrid welding of sheet metals. Material of the sheets is an AlMg3Mn aluminum alloy, with a thickness of 3.5 mm. The 2-D T-joint...

Research Paper

June 2, 2022


Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test
Myeongin Kim, Won Sik Hong, Mi-Song Kim
J Weld Join. 2022;40(3):271-277.

In this study, the laser soldering process of probe-multilayer ceramic (MLC) substrates was optimized using Type 4 (T4) and Type 7 (T7) Sn-3.0Ag-0.5Cu (SAC305), T7 Sn-0.7Cu solders to improve the...

Research Paper

June 2, 2022


Thermal Elasto-Plastic Analysis of Large Steel Plate Cutting Using Layered Shell Elements
Jung-Goo Park
J Weld Join. 2022;40(3):278-285.

In this study, plasma cutting deformation of a large plate was simulated by applying a thermal elasto-plastic analysis technique using a layered shell elements. First, plasma cutting heat source model...
Current Issue
Volume 40(3); Jun 2022
Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints
Mi-Song Kim, Won Sik Hong, Hye-Min Lee, Myeongin Kim
J Weld Join. 2022;40(3):207-214.

Research Paper
A Review of the Brazeability of Low-Temperature and Nano-Reinforced Al-Based Brazing Filler Metals
Furkan, Hye-Jeong Kim, Gun-hwan Lee, Jae Pil Jung
J Weld Join. 2022;40(3):216-224.

Review Paper
Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with ENEPIG Surface Finish
Jieun Yu, Sujong Kim, Won Sik Hong, Namhyun Kang
J Weld Join. 2022;40(3):225-232.

Research Paper
Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles
Dong-Hwan Lee, Min-Haeng Heo, Jeong-Won Yoon
J Weld Join. 2022;40(3):233-241.

Review Paper
Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers
Min Jeong Ha, Ji-Ho Kim, Jae-Goo Han, Jin-Seok Yang, Jong-Min Kim, Byung-Seung Yim
J Weld Join. 2022;40(3):242-247.

Research Paper
Deposition of a Porous Cu Layer by Electroplating and Feasibility Evaluation of Cu-Cu Die Attachment by Sinter Bonding Using Thermo-Compression
Doyeop Namgoong, Jong-Hyun Lee
J Weld Join. 2022;40(3):248-255.

Research Paper
Study on Effect of Process Variable on Fastening Quality Using Process Monitoring Data of Flow Drill Screwed 590DP Steel/AA5052 combination
Tae-Young Kang, Han-ju Lee, Karim Md Abdul, Dae-Geun Nam, Byeong-ryong Lee, Jung-Muk Choi, Yeong-Do Park
J Weld Join. 2022;40(3):256-264.

Research Paper
FEA Simulation Based Power Adaption for Laser Welding of Radii
Johannes Gaigl
J Weld Join. 2022;40(3):265-270.

Research Paper
Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test
Myeongin Kim, Won Sik Hong, Mi-Song Kim
J Weld Join. 2022;40(3):271-277.

Research Paper
Thermal Elasto-Plastic Analysis of Large Steel Plate Cutting Using Layered Shell Elements
Jung-Goo Park
J Weld Join. 2022;40(3):278-285.

Research Paper

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