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Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints
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J Weld Join. 2022;40(3):207-214.
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A Review of the Brazeability of Low-Temperature and Nano-Reinforced Al-Based Brazing Filler Metals
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Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles
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Conduction Path Formation Characteristics of Solderable Polymer Composite Filled with Low-Melting-Point and High-Melting-Point Alloy Fillers
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J Weld Join. 2022;40(3):242-247.
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Deposition of a Porous Cu Layer by Electroplating and Feasibility Evaluation of Cu-Cu Die Attachment by Sinter Bonding Using Thermo-Compression
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Study on Effect of Process Variable on Fastening Quality Using Process Monitoring Data of Flow Drill Screwed 590DP Steel/AA5052 combination
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J Weld Join. 2022;40(3):256-264.
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FEA Simulation Based Power Adaption for Laser Welding of Radii
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J Weld Join. 2022;40(3):265-270.
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Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test
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J Weld Join. 2022;40(3):271-277.
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Thermal Elasto-Plastic Analysis of Large Steel Plate Cutting Using Layered Shell Elements
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J Weld Join. 2022;40(3):278-285.
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