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Recent Progress of TGV Technology for High Performance Semiconductor Packaging
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Optimization of TLPS Bonding Process and Joint Property using Ni-Sn Paste for High Temperature Power Module Applications
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Thermal Cycling Performance of Heterogeneous Solder Ball Joints with Sn-3.0Ag-0.5Cu and Sn-0.75Cu(-Ni,Bi) Solder Ball Composition for BGA Package
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A Study on the Microstructure and Mechanical Properties of Electron Beam Welds of SA508 Gr.3 Cl.1 steel with Different Heat Treatment conditions for Small Modular Reactor
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Mechanical Properties of Fe-TiC Composites for Friction Stir Welding Tool Application by a Spark Plasma Sintering
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Review on Ultrasonic Welding Quality Monitoring Technology
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Changes in the Mechanical Properties and Microstructure of High Manganese Steel by High Heat Input Welding and General Welding Processes
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Review on Vacuum Laser Beam Welding
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Review Paper

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A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
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Fundamental Experiments of Pulsed GMA Additive Manufacturing
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Strategy of Suppressing the Solidification Cracking Susceptibility of 247LC Superalloy Weld Metals using Commercial Ni-Based Fillers
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Research Paper

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