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Research Paper

April 30, 2024


Mechanical Bonding Properties of Solderable Anisotropic Polymer Composite containing Low-Melting-Point and High-Melting-Point Solder Fillers
Yi Hyeon Ha, Myeong Jin Jung, Jong-Moon Park, et al.
J Weld Join. 2024;42(2):149-154.

In this papers, to enhance the mechanical bonding properties of solderable anisotropic polymer composites (SAPCs) containing low-melting-point solder filler only, a new low-melting-point solder and high-melting-point solder mixed filler filled...

Research Paper

April 30, 2024


Recent Progress of TGV Technology for High Performance Semiconductor Packaging
Beom Chang Seok, Jae Pil Jung
J Weld Join. 2024;42(2):155-164.

In recent semiconductor packaging, the adoption of through silicon via (TSV) technology has become crucial for the integration of 2.5 and 3D Si chips, and interposers. The TSV offers significant...

Research Paper

April 30, 2024


Optimization of TLPS Bonding Process and Joint Property using Ni-Sn Paste for High Temperature Power Module Applications
Da-Gyeong Han, Dong-Hwan Lee, Jeong-Won Yoon
J Weld Join. 2024;42(2):165-173.

Recently, as interest in eco-friendly vehicles such as electric and hybrid vehicles increases, the demand for power semiconductors, a key component, is also increasing. Power semiconductors convert, distribute, and control...

Research Paper

April 30, 2024


Thermal Cycling Performance of Heterogeneous Solder Ball Joints with Sn-3.0Ag-0.5Cu and Sn-0.75Cu(-Ni,Bi) Solder Ball Composition for BGA Package
Joo Young Bae, Mi-Song Kim, So-Hee Hyun, et al.
J Weld Join. 2024;42(2):174-183.
Sn-3.0Ag-0.5Cu (SAC305) is one of the most commonly used Pb-free solder composition nowadays. A minor alloying element addition can improve mechanical properties and thermal reliability of the solder joint. Minor...

Research Paper

April 30, 2024


High-Speed Thermo-Compression Sinter-Bonding Properties in Air of a Paste Containing Dendritic Cu Particles Having Oxalate Skins
Horyun Kim, Jong-Hyun Lee
J Weld Join. 2024;42(2):184-192.
To enhance the sinter-bonding speed of Cu dendrite particle-based paste, the particles were surface-treated with oxalic acid solution. This treatment transitioned the particle surface from an oxide layer to a...

Research Paper

April 30, 2024


A Study on the Microstructure and Mechanical Properties of Electron Beam Welds of SA508 Gr.3 Cl.1 steel with Different Heat Treatment conditions for Small Modular Reactor
In-Chul Jung, Heon-Min Suh, In-Sung Choi, et al.
J Weld Join. 2024;42(2):193-199.
Electron beam welding was conducted on SA508 Gr.3 Cl.1 steel, which is being considered as a material used in the pressure vessel steel of small modular reactors. The characteristics of...

Research Paper

April 30, 2024


Effect of Cr on the Hot Ductility of Austenitic Fe-Mn-Al-C Lightweight Steel
Seonghoon Jeong, Joonoh Moon, Seong-Jun Park, et al.
J Weld Join. 2024;42(2):200-205.
In this study, a hot ductility test was performed for Fe-30Mn-10.5Al-0.9C-Cr austenitic lightweight steels. The test was carried out through a commercial Gleeble simulator at a heating rate of 350...

Research Paper

April 30, 2024


Mechanical Properties of Fe-TiC Composites for Friction Stir Welding Tool Application by a Spark Plasma Sintering
Bum-Soon Park, Min-Hyeok Yang, Hyun-Kuk Park
J Weld Join. 2024;42(2):206-214.
TiC, which has high hardness, was added to reinforcing material to improve the mechanical property of Fe. Fe-TiC composites as a function of TiC contents were fabricated by high energy...

Research Paper

April 30, 2024


Review on Ultrasonic Welding Quality Monitoring Technology
Byeong-Jin Kim, Insung Hwang, Seong-Guk Son, et al.
J Weld Join. 2024;42(2):215-222.
To produce batteries for electric vehicles, various welding processes are used, of which ultrasonic welding is an important one. In recent years, the quality control of welded components has become...
Current Issue
Volume 42(2); Apr 2024
Mechanical Bonding Properties of Solderable Anisotropic Polymer Composite containing Low-Melting-Point and High-Melting-Point Solder Fillers
Yi Hyeon Ha, Myeong Jin Jung, Jong-Moon Park, Sung Woo Choi, Jong-Min Kim, Byung-Seung Yim
J Weld Join. 2024;42(2):149-154.

Research Paper
Recent Progress of TGV Technology for High Performance Semiconductor Packaging
Beom Chang Seok, Jae Pil Jung
J Weld Join. 2024;42(2):155-164.

Research Paper
Optimization of TLPS Bonding Process and Joint Property using Ni-Sn Paste for High Temperature Power Module Applications
Da-Gyeong Han, Dong-Hwan Lee, Jeong-Won Yoon
J Weld Join. 2024;42(2):165-173.

Research Paper
Thermal Cycling Performance of Heterogeneous Solder Ball Joints with Sn-3.0Ag-0.5Cu and Sn-0.75Cu(-Ni,Bi) Solder Ball Composition for BGA Package
Joo Young Bae, Mi-Song Kim, So-Hee Hyun, Jong-Hyun Lee, Jeong Tak Moon, Young-Woo Lee, Seul Gi Lee, Hyeong-Tea Kim, Seung-Kwan Baek, Won Sik Hong
J Weld Join. 2024;42(2):174-183.

Research Paper
High-Speed Thermo-Compression Sinter-Bonding Properties in Air of a Paste Containing Dendritic Cu Particles Having Oxalate Skins
Horyun Kim, Jong-Hyun Lee
J Weld Join. 2024;42(2):184-192.

Research Paper
A Study on the Microstructure and Mechanical Properties of Electron Beam Welds of SA508 Gr.3 Cl.1 steel with Different Heat Treatment conditions for Small Modular Reactor
In-Chul Jung, Heon-Min Suh, In-Sung Choi, Jeong Suh, Seong-Woo Jo, Deog-Nam Shim, Hyun-Uk Hong
J Weld Join. 2024;42(2):193-199.

Research Paper
Effect of Cr on the Hot Ductility of Austenitic Fe-Mn-Al-C Lightweight Steel
Seonghoon Jeong, Joonoh Moon, Seong-Jun Park, Changhee Lee
J Weld Join. 2024;42(2):200-205.

Research Paper
Mechanical Properties of Fe-TiC Composites for Friction Stir Welding Tool Application by a Spark Plasma Sintering
Bum-Soon Park, Min-Hyeok Yang, Hyun-Kuk Park
J Weld Join. 2024;42(2):206-214.

Research Paper
Review on Ultrasonic Welding Quality Monitoring Technology
Byeong-Jin Kim, Insung Hwang, Seong-Guk Son, Chanhoon Park, Young-Min Kim
J Weld Join. 2024;42(2):215-222.

Research Paper

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