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A Study on the Adhesive Characteristics of Nano Scale Particles Considering Asperity Interaction: Chang-Hun Lee, Kyong-Hun Lee, Jun-Ho Yoon, Young-Eui Shin; J Weld Join. 2008;26(1):56-62. Published online March 21, 2008; PDF

Flow Characteristics and Filling Time Estimation for Underfill Process: Hyung-Sub Sim, Seong-Hyuk Lee, Jong-Min Kim, Young-Eui Shin; J Weld Join. 2007;25(3):45-50. Published online July 19, 2007; PDF

Fabrication of Through-hole Interconnect in Si Wafer for 3D Package: Dae-Gon Kim, Jong-Woong Kim, Sang-Su Ha et al.; J Weld Join. 2006;24(2):64-70. Published online July 18, 2006; PDF

High Density Stacking Process and Reliability of Electronic Packaging: Young-Eui Shin, Jong-Min Kim, Young-Tark Kim, Joo-Seok Kim; J Weld Join. 2006;24(2):10-16. Published online July 18, 2006; PDF

Evaluation of Pul Strengths and Fracture Modes of Solder Joints by Modified Ball Pull Testing with Protrusion Jaw: Hyoung-Il Kim, Sung-Won Han, Jong-Min Kim, Myung-Ki Choi, Young-Eui Shin; J Weld Join. 2005;23(4):34-40. Published online September 22, 2005; PDF

Electrically Conductive Adhesive Bonding Technology for Microsystems Packaging: Jong-Min Kim, Seung-Mock Lee, Young-Eui Shin; J Weld Join. 2005;23(2):18-22. Published online May 12, 2005; PDF

The Thermal Fatigue Analysis and Life Evaluation of Solder Joint for Flip Chip Package using Darveaux Model: Young-Eui Shin, Yeon-Sung Kim, Jong-Min Kim, Myun-Gi Choi; J Weld Join. 2004;22(6):36-42. Published online January 26, 2005; PDF

A Study on the High Temperature Tensile Property and the Characteristics of Residual Stress in Welds of High Strength Steels: Kyong-Ho Chang, Chin-Hyung Lee, Young-Eui Shin; J Weld Join. 2004;22(4):50-58. Published online September 15, 2004; PDF

Thermal Fatigue Characteristics of μBGA Solder Joints with Underfill: Young-Wook Koh, Jong-Min Kim, Jun-Hwan Lee, Young-Eui Shin; J Weld Join. 2003;21(4):25-30. Published online August 25, 2003; PDF

Volume 42, No. 2

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

MOST VIEWED MOST CITED

7,591	Review on Vacuum Laser Beam Welding
4,070	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
3,817	Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
3,799	Study on Laser Welding of Dissimilar Materials between Aluminum and Copper (Ⅰ) - Research Trend in Laser Welding Technology and Materials Testing Methods -
3,687	Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles

Cited By 9	Changes in the Mechanical Properties and Microstructure of High Manganese Steel by High Heat Input Welding and General Welding Processes
Cited By 7	Review on Vacuum Laser Beam Welding
Cited By 6	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
Cited By 6	Comparison of Welding Deformation Characteristics by Circumferential Welding for Austenitic and Duplex Stainless Steel Pipe : Experimental Study
Cited By 6	Development and Evaluation of Stainless Steel-Base Flux-Cored Wires for 9% Nickel Steel

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