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Journal of KWJS 2006;24(2):10-16.
Published online July 18, 2006.
전자 패키징의 고밀도 실장프로세스와 신뢰성
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High Density Stacking Process and Reliability of Electronic Packaging
Young-Eui Shin, Jong-Min Kim, Young-Tark Kim, Joo-Seok Kim
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