Flow Characteristics and Filling Time Estimation for Underfill Process

Sim, Hyung-Sub; Lee, Seong-Hyuk; Kim, Jong-Min; Shin, Young-Eui

Journal of KWJS 2007;25(3):45-50.
Published online July 19, 2007.

언더필 공정에 대한 유동 특성과 침투 시간 예측 연구

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Flow Characteristics and Filling Time Estimation for Underfill Process

Hyung-Sub Sim, Seong-Hyuk Lee, Jong-Min Kim, Young-Eui Shin

Abstract

The present study is devoted to investigate the transient flow and to estimate the filling time for underfill process by using the numerical model established on the fluid momentum equation. For optimization of the design and selection of process parameters, this study extensively presents an estimation of the filling time in the view points of some important factors related to underfill materials and flip-chip geometry. From the results, we conclude that the filling time changes with respect to the under fill materials because of different viscosity, surface tension coefficient and contact angle. It reveals that, as the gap height increases, the filling time decreases substantially, and goes to the saturated values.

Key Words: Underfill process, Flow characteristics, Filling time, Solder bump resistance, Flip chip