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2032348
Bonding Properties of Package-on-Package Stack Interconnection Using by 150 ㎛ Height Copper Posts
Mi-Song Kim, So-Hee Hyun, Joo Young Bae, Won Sik Hong
J Weld Join. 2024;42(4):378-387.   Published online August 31, 2024
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2032329
Thermal Cycling Performance of Heterogeneous Solder Ball Joints with Sn-3.0Ag-0.5Cu and Sn-0.75Cu(-Ni,Bi) Solder Ball Composition for BGA Package
Joo Young Bae, Mi-Song Kim, So-Hee Hyun et al.
J Weld Join. 2024;42(2):174-183.   Published online April 30, 2024
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Electrochemical Metallic Ion Migration Property of Multi-Layer Ceramic Capacitor for Car Electronics
Won Sik Hong, Mi-Song Kim, Joo Young Bae et al.
J Weld Join. 2023;41(6):519-527.   Published online December 31, 2023
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2032294
Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes
So-Hee Hyun, Hye Min Lee, Mi-Song Kim, Won Sik Hong
J Weld Join. 2023;41(5):387-395.   Published online October 31, 2023
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