Search

  • HOME
  • Search
2032348
Bonding Properties of Package-on-Package Stack Interconnection Using by 150 ㎛ Height Copper Posts
Mi-Song Kim, So-Hee Hyun, Joo Young Bae, Won Sik Hong
J Weld Join. 2024;42(4):378-387.   Published online August 31, 2024
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
2032294
Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes
So-Hee Hyun, Hye Min Lee, Mi-Song Kim, Won Sik Hong
J Weld Join. 2023;41(5):387-395.   Published online October 31, 2023
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong
J Weld Join. 2022;40(2):165-174.   Published online April 21, 2022
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    
2032163
Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing
Mi-Song Kim, Won Sik Hong, Myeongin Kim
J Weld Join. 2021;39(4):359-367.   Published online August 23, 2021
Full textFull text    PubreaderPubReader    ePubePub    PDFPDF    

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

Register for e-submission  Register for e-submission
Register here to access the e-submission system of Journal of Welding and Joining for authors and reviewers.
Register for e-submission  Manuscript Submission
To submit a manuscript, please visit the Journal of Welding and Joining e-submission management system at https://submit.e-jwj.org, read the Instructions for Authors, and log into the Journal of Welding and Joining e-submission system.
For assistance with manuscript submission, please contact: koweld@kwjs.or.kr.
Register for e-submission  Free archive
Anyone may access any past or current articles without logging in.


ABOUT
BROWSE ARTICLES
ARTICLE CATEGORY 
FOR CONTRIBUTORS
Editorial Office
#304, San-Jeong Building, 23, Gukhoe-daero 66-gil, Yeongdeungpo-gu, Seoul 07237, Korea
Tel: +82-2-538-6511    Fax: +82-2-538-6510    E-mail: koweld@kwjs.or.kr                

Copyright © 2024 by The Korean Welding and Joining Society.

Developed in M2PI