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295 Three-Dimesnional Semicondoctor Stacking using TSV(Through-Si-Via) Technology   
Do Hoon Cho, Hye Jun Kang, Seong Min Seo, Jang Baeg Kim, Sri Harini Rajendran, Jae Pil Jung
Journal of Welding and Joining:295-303.  Publication Date (Web): May 17, 2021
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11 Various Cu Filling Methods of TSV for Three Dimensional Packaging   
Myong-Hoon Roh, Jun-Hyeong Lee, Wonjoong Kim, Jae Pil Jung, Hyeong-Tea Kim
Journal of Welding and Joining:11-16.  Publication Date (Web): June 30, 2013
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