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Thermal Cycling Performance of Heterogeneous Solder Ball Joints with Sn-3.0Ag-0.5Cu and Sn-0.75Cu(-Ni,Bi) Solder Ball Composition for BGA Package
Joo Young Bae, Mi-Song Kim, So-Hee Hyun et al.
J Weld Join. 2024;42(2):174-183.   Published online April 30, 2024
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Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package
Joo Young Bae, Mi-Song Kim, Hye Min Lee et al.
J Weld Join. 2023;41(5):379-386.   Published online October 31, 2023
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Crack Propagation Characterization Applying High Manganese Austenitic Steel to Independent Type B Tank
Sung-Ku Kang
J Weld Join. 2022;40(1):9-15.   Published online February 28, 2022
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A Study on Prediction of Fatigue Life using MFC Sensors
Ji-Hoon Lee, Dong-Jin Oh, Myung-Hyun Kim
J Weld Join. 2013;31(6):32-36.   Published online January 21, 2014
PWSCC Crack Growth Analysis Using Numerical Method in the Inner Surface Repair Weld of A Nozzle
Sang-chul Kim, Mann-won Kim
J Weld Join. 2011;29(2):64-71.   Published online May 7, 2011
Fatigue Crack Propagation Life Assessment of T-joint Fillet Weldment Considering Residual Stress under Random Loading
Sung-Hoon Kim, Kyung-Su Kim, Jang-Hyun Lee, Chang-Hyuk Yoo, Won-Hyo You, Mi-Ji Yoo
J Weld Join. 2011;29(2):46-55.   Published online May 7, 2011
Crack Growth Analysis of Dissimilar Metal Weld using a Numerical Method
Sang-Chul Kim, Maan-Won Kim
J Weld Join. 2010;28(1):100-106.   Published online March 10, 2010
An Evaluation of Residual Stress Redistribution in the Welding Residual Stress Field Caused by Fatigue Crack Propagation by Finite Element Method
Eung-Joon Park, Eung-Joon Kim
J Weld Join. 2008;26(6):92-96.   Published online January 13, 2009

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