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Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles: Dong-Hwan Lee, Min-Haeng Heo, Jeong-Won Yoon; J Weld Join. 2022;40(3):233-241. Published online June 2, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.3.4; Full text PubReader ePub Crossref - TDM PDF

A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste: Jeong-Won Yoon, Dong-Hwan Lee, Byung-Suk Lee; J Weld Join. 2021;39(4):376-383. Published online August 23, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.5
Cited By 3; Full text PubReader ePub Crossref - TDM PDF

The Effect of Environmental Test on the Shear Strength of the Ultrasonic bonded Cu Terminal for Power Module: Kyung-Yeol Kim, Kyung Deuk Min, Yongil Kim, Jeong-Won Yoon, Seung-Boo Jung; J Weld Join. 2019;37(2):1-6. Published online April 25, 2019; DOI: https://doi.org/10.5781/JWJ.2019.37.2.1
Cited By 1; Full text PubReader ePub Crossref - TDM PDF

Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications: Byung-Suk Lee, Jong-Hoon Back, Jeong-Won Yoon; J Weld Join. 2019;37(2):26-34. Published online April 22, 2019; DOI: https://doi.org/10.5781/JWJ.2019.37.2.5
Cited By 9; Full text PubReader ePub Crossref - TDM PDF

Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints: Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon; J Weld Join. 2018;36(5):52-60. Published online September 17, 2018; DOI: https://doi.org/10.5781/JWJ.2018.36.5.7
Cited By 3; Full text PubReader ePub Crossref - TDM PDF

Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint: Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon; J Weld Join. 2017;35(6):51-58. Published online December 4, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.6.8
Cited By 6; Full text PubReader ePub Crossref - TDM PDF

Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module: Junhyuk Son, Minkyung Kim, Dong-Yurl Yu et al.; J Weld Join. 2017;35(5):38-47. Published online September 26, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.5.6
Cited By 8; Full text PubReader ePub Crossref - TDM PDF

Effects of Ni-P Bath on the Brittle Fracture of Sn-Ag-Cu Solder/ENEPIG Solder Joint: Kyoung-Ho Kim, Wonil Seo, Sang-Hyun Kwon, Jun-Ki Kim, Jeong-Won Yoon, Sehoon Yoo; J Weld Join. 2017;35(3):1-6. Published online June 30, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.3.1
Cited By 2; Full text PubReader ePub Crossref - TDM PDF

Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint: Jung-Hwan Bang, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee; J Weld Join. 2016;34(1):26-34. Published online February 29, 2016; DOI: https://doi.org/10.5781/JWJ.2016.34.1.26
Cited By 6; Full text PubReader ePub Crossref - TDM PDF

Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging: Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Bo-In Noh, Seung-Boo Jung; J Weld Join. 2008;26(1):37-43. Published online March 21, 2008; PDF

Ultrasonic Bonding Technology for Flip Chip Packaging: Ja-Myeong Koo, Jong-Woong Kim, Jeong-Won Yoon et al.; J Weld Join. 2008;26(1):31-36. Published online March 21, 2008; PDF

Electrical Characterization of Electronic Package: Jong-Woong Kim, Ja-Myeong Koo, Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung; J Weld Join. 2008;26(1):17-23. Published online March 21, 2008; PDF

Sn-Xwt%Cu계 솔더의 젖음성에 관한 연구Study on Wettability of Sn-Xwt%Cu Solder: Bo-In Noh, Jeong-Won Yoon, Bui Quoc, Seung-Boo Jung; J Weld Join. 2007;25(5):78-83. Published online January 28, 2008; PDF

Flip-chip Bonding Technology and Reliability of Electronic Packaging: Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo et al.; J Weld Join. 2007;25(2):6-15. Published online May 17, 2007; PDF

Core Technology of Electronic Packaging: Jeong-Won Yoon, Won-Chul Moon, Seung-Boo Jung; J Weld Join. 2005;23(2):10-17. Published online May 12, 2005; PDF

Volume 41, No. 2

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

MOST VIEWED MOST CITED

5,358	Review on the Recent Welding Research with Application of CNN-Based Deep Learning Part I: Models and Applications
4,396	Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration
3,720	Study on Laser Welding of Al-Cu Dissimilar Material by Green Laser and Weld Quality Evaluation by Deep Learning
3,398	Solidification Cracking Susceptibility of the Weld Metal of Additively Manufactured 316L Stainless Steel
3,388	Modeling of Laser Welds Using Machine Learning Algorithm Part I: Penetration Depth for Laser Overlap Al/Cu Dissimilar Metal Welds

Cited By 13	Solidification Cracking Susceptibility of the Weld Metal of Additively Manufactured 316L Stainless Steel
Cited By 13	Evaluating the Welding Pulses of Various Tool Profiles in Single-Pass Friction Stir Welding of 6082-T6 Aluminium Alloy
Cited By 11	Review on the Recent Welding Research with Application of CNN-Based Deep Learning Part I: Models and Applications
Cited By 9	Modeling of Laser Welds Using Machine Learning Algorithm Part II: Geometry and Mechanical Behaviors of Laser Overlap Welded High Strength Steel Sheets
Cited By 8	Review on the Recent Welding Research with Application of CNN-Based Deep Learning Part II: Model Evaluation and Visualizations

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