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2032214
Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles
Dong-Hwan Lee, Min-Haeng Heo, Jeong-Won Yoon
J Weld Join. 2022;40(3):233-241.   Published online June 2, 2022
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A Study of Transient Liquid Phase Bonding Using an Ag-Sn3.0Ag0.5Cu Hybrid Solder Paste
Jeong-Won Yoon, Dong-Hwan Lee, Byung-Suk Lee
J Weld Join. 2021;39(4):376-383.   Published online August 23, 2021
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2032013
The Effect of Environmental Test on the Shear Strength of the Ultrasonic bonded Cu Terminal for Power Module
Kyung-Yeol Kim, Kyung Deuk Min, Yongil Kim, Jeong-Won Yoon, Seung-Boo Jung
J Weld Join. 2019;37(2):1-6.   Published online April 25, 2019
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Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications
Byung-Suk Lee, Jong-Hoon Back, Jeong-Won Yoon
J Weld Join. 2019;37(2):26-34.   Published online April 22, 2019
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Effect of Thin ENEPIG Plating Thickness on Interfacial Reaction and Brittle Fracture Rate of Sn-3.0Ag-0.5Cu Solder Joints
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
J Weld Join. 2018;36(5):52-60.   Published online September 17, 2018
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Interfacial reactions and mechanical strength of Sn-3.0Ag-0.5Cu/0.1㎛-Ni thin ENEPIG solder joint
Jong-Hoon Back, Sehoon Yoo, Deok-Gon Han, Seung-Boo Jung, Jeong-Won Yoon
J Weld Join. 2017;35(6):51-58.   Published online December 4, 2017
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Thermal Aging Characteristics of Sn-xSb Solder for Automotive Power Module
Junhyuk Son, Minkyung Kim, Dong-Yurl Yu et al.
J Weld Join. 2017;35(5):38-47.   Published online September 26, 2017
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2031838
Effects of Ni-P Bath on the Brittle Fracture of Sn-Ag-Cu Solder/ENEPIG Solder Joint
Kyoung-Ho Kim, Wonil Seo, Sang-Hyun Kwon, Jun-Ki Kim, Jeong-Won Yoon, Sehoon Yoo
J Weld Join. 2017;35(3):1-6.   Published online June 30, 2017
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2031728
Lead-free Solder for Automotive Electronics and Reliability Evaluation of Solder Joint
Jung-Hwan Bang, Dong-Yurl Yu, Young-Ho Ko, Jeong-Won Yoon, Chang-Woo Lee
J Weld Join. 2016;34(1):26-34.   Published online February 29, 2016
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Au-Sn Flip-chip Bumping Technology and Reliability for Optoelectronic Packaging
Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo, Bo-In Noh, Seung-Boo Jung
J Weld Join. 2008;26(1):37-43.   Published online March 21, 2008
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Ultrasonic Bonding Technology for Flip Chip Packaging
Ja-Myeong Koo, Jong-Woong Kim, Jeong-Won Yoon et al.
J Weld Join. 2008;26(1):31-36.   Published online March 21, 2008
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Electrical Characterization of Electronic Package
Jong-Woong Kim, Ja-Myeong Koo, Jeong-Won Yoon, Bo-In Noh, Seung-Boo Jung
J Weld Join. 2008;26(1):17-23.   Published online March 21, 2008
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Sn-Xwt%Cu계 솔더의 젖음성에 관한 연구Study on Wettability of Sn-Xwt%Cu Solder
Bo-In Noh, Jeong-Won Yoon, Bui Quoc, Seung-Boo Jung
J Weld Join. 2007;25(5):78-83.   Published online January 28, 2008
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Flip-chip Bonding Technology and Reliability of Electronic Packaging
Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo et al.
J Weld Join. 2007;25(2):6-15.   Published online May 17, 2007
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Core Technology of Electronic Packaging
Jeong-Won Yoon, Won-Chul Moon, Seung-Boo Jung
J Weld Join. 2005;23(2):10-17.   Published online May 12, 2005
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