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Reliability Evaluation of Electronic Circuit Printed Using Metallic Ink
Ja-Myeong Koo, Jong-Bum Lee, Sang-Su Ha et al.
J Weld Join. 2008;26(2):37-42.   Published online June 18, 2008
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Ultrasonic Bonding Technology for Flip Chip Packaging
Ja-Myeong Koo, Jong-Woong Kim, Jeong-Won Yoon et al.
J Weld Join. 2008;26(1):31-36.   Published online March 21, 2008
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Flip-chip Bonding Technology and Reliability of Electronic Packaging
Jeong-Won Yoon, Jong-Woong Kim, Ja-Myeong Koo et al.
J Weld Join. 2007;25(2):6-15.   Published online May 17, 2007
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Thermo-Mechanical Reliability of Lead-Free Surface Mount Assemblies for Auto-Mobile Application
Sang-Su Ha, Jong-Woong Kim, Jong-Hyuck Chae et al.
J Weld Join. 2006;24(6):21-27.   Published online February 12, 2007
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Fabrication of Through-hole Interconnect in Si Wafer for 3D Package
Dae-Gon Kim, Jong-Woong Kim, Sang-Su Ha et al.
J Weld Join. 2006;24(2):64-70.   Published online July 18, 2006
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Application of MEMS Technology in Microelectronic Packaging
Jong-Woong Kim, Dae-Gon Kim, Won-Chul Moon, Jeong-Hoon Moon, Chang-Chae Shur, Seung-Boo Jung
J Weld Join. 2006;24(2):34-41.   Published online July 18, 2006
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