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Improvement of Solder Joint Strength in SAC 305 Solder Ball to ENIG Substrate Using LF Hydrogen Radical Treatment
Ah-reum Lee, Seung-jae Jo, Jai-hyun Park, Chung-yun Kang
J Weld Join. 2011;29(1):99-106.   Published online March 4, 2011
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Standardization of Mechanical Test Method for Lead-Free Solder Paste - Shear Test Method for Chip Joint -
Jai-Hyun Park, Jong-Hyun Lee, Yong-Sik Ahn
J Weld Join. 2007;25(2):37-42.   Published online May 17, 2007
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Packaging Technology in Electronics and 3-dimensional Stacking Packaging
Jung-Mo Kim, Jae-Pil Jung, Sook-Hwan Kim, Jai-Hyun Park
J Weld Join. 2005;23(2):23-31.   Published online May 12, 2005
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