Evaluation of Flaws in Adhesively Bonded Joint using Ultrasonic Signal Analysis

Hwang, Yeong-Taik; Oh, Seung-Kyu; Han, Jun-Young; Jang, Sup-Chul; Yun, Song-Nam; Yi, Won; Kim, Hwan-Tae

Journal of KWJS 2004;22(2):38-45.
Published online September 15, 2004.

[연구논문] 초음파 신호분석을 이용한 접착접합 이음의 결함평가

, , , , , ,

Evaluation of Flaws in Adhesively Bonded Joint using Ultrasonic Signal Analysis

Yeong-Taik Hwang, Seung-Kyu Oh, Jun-Young Han, Sup-Chul Jang, Song-Nam Yun, Won Yi, Hwan-Tae Kim

Abstract

Ultrasonic signals transmitted through adhesively bonded plates were used to evaluate parameters related to attenuation and frequency in the adhesively bonded joint. The kinds of bonding materials with a different bonding thickness of constant pressure were used. And, ultrasonic diagnosis was evaluated by p-wave sensor of 10㎒. FFT has been performed to determine bond-layer parameters such as effective thickness and frequency for adhesively bonded joint of AI6061 plates in comparison with measured to theoretical ratios. When variable thickness exists, the ultrasonic spectrum was changed the frequency wave. The more materials thickness and the higher the frequency, the larger shift was observed. Measured ratios for cases of bond thickness and variety bonding materials are then used to determine bond parameters. The results show that the technique can be applied to the characterization of adhesively bonded joint.