Thermal Stability of the Mechanical and Thermal Conductive Properties on Cu-STS-Cu Clad Metal for LED Package Lead Fram

Kim, Young-Sung; Kim, Il-Gwon

doi:2013.31.5.77

J Weld Join > Volume 31(5); 2013 > Article

Research Paper

Journal of KWJS 2013;31(5):77-81.
DOI: https://doi.org/10.5781/KWJS.2013.31.5.77 Published online November 5, 2013.

Thermal Stability of the Mechanical and Thermal Conductive Properties on Cu-STS-Cu Clad Metal for LED Package Lead Fram

Young-Sung Kim¹, Il-Gwon Kim²

Correspondence: Young-Sung Kim,
Email: youngsk@seoultech.ac.kr

Abstract

We have investigated thermal stability of the mechanical and thermal conductive properties of Cu/STS/Cu 3 layered clad metal lead frame material for a LED device package at different temperatures ranging from RT to 200℃. The fabricated Cu/STS/Cu clad metal has a good thermal stability for the mechanical tensile strength and thermal conductivity of the over 50 Kg/mm2 to the 150℃ and 270 W/m?K to the 200℃, respectively. This clad metal lead frame material at a high temperature of 150℃ shows a reinforced mechanical tensile strength by 1.5 times to conventional pure copper lead frame materials and also a comparable thermal conductivity to typical copper alloy lead frame materials.

Key Words: Clad metal, LED lead frame, Thermal stability, Thermal conductivity