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Thermal Stability of the Mechanical and Thermal Conductive Properties on Cu-STS-Cu Clad Metal for LED Package Lead Fram
Young-Sung Kim, Il-Gwon Kim
Journal of KWJS. 2013;31(5):77-81. Published online 2013 Nov 5 DOI: https://doi.org/10.5781/KWJS.2013.31.5.77
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Citations to this article as recorded by
 Fabrication of the Cu-STS-Cu Clad Metal for High Strength Electric Device Lead Frame and Thermal Stability on Their Physical Properties
Il-Gwon Kim, Moon-Eui Son, Young-Sung Kim
Journal of Welding and Joining.2014; 32(5): 80. CrossRef
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