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JWJ > Volume 23(6); 2005 > Article
Journal of KWJS 2005 December;23(6) :93-98.
Published online January 26, 2006.
A Characteristics of Zn-Al-Cu System Pb-free Solder Alloys for Ultra High Temperature Applications
Seong-Jun Kim, Hye-Seong Na, Tae-Kyo Han, Bong-Keun Lee, Chung-Yun Kang




Correspondence:   Published online January 26, 2006
ABSTRACT
The purpose of this study is to investigate the characteristics of Pb-free Zn-(3~6)%Al-(1~6)%Cu solder alloys for ultra high temperature(>573K) which applied to air craft, space satellite, automotive, oil, gas well exploration and data logging of geo-thermal wells. Melting range, solderability, electric resistivity, microstructure and mechanical properties were examined with solder alloys casted in Ar gas atmosphere. Zn-4%A1-(1∼3)%Cu, Zn-5%Al-(2∼4)%Cu and Zn-6%Al-(3∼5)%Cu alloys satisfied the optimum melting range of 643 to 673K for ultra high temperature solder. A melting temperature increased with increasing Cu content, but decreased with increasing Al content. The spreadability was improved with increasing Al content. But the content of Cu had no effect on the spreadability. The electric resistivity was lowered with increasing Al and decreasing Cu content. In all Zn-Al-Cu solder alloys, primary dendritic ε phase(Zn-Cu), dendritic η phase(Zn-Cu-Al), α(Al-Zn)-η eutectic and eutectoid phase were observed. The addition of Al increased the volume fraction of eutectic and eutectoid phase and it decreased η phases. Also, the addition of Cu increased slightly the volume fraction of ε, the eutectic and eutectoid phases. With increasing total content of Al and Cu, a hardness and a tensile strength were linearly increased, but an elongation was linearly decreased.
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