A prediction of the thermal fatigue life of solder joint in IC package for surface mount

윤준호,; 신영의,

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Journal of KWJS 1998;16(4):92-97.
Published online August 25, 1998.

표면실장용 IC 패키지 솔더접합부의 열피로 수명 예측

A prediction of the thermal fatigue life of solder joint in IC package for surface mount

윤준호, 신영의

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