1. B. Altshuller, Aluminum Brazing Handbook, 4th ed, The Aluminum Association Inc, Washington, USA. (1990)
2. H. C. Yoo and H. T. Kim, Recent Technological Tendency of Joining For Light Aluminium Alloy,
J. Korean Weld. Join. Soc. 29(3) (2011) 260–269.
[CROSSREF]
3. I. J. Polmear, Light Alloys from Traditional Alloys to Nanocrystals, 4th ed, Elsevier-Butterworth Heinemann, Oxford. (2006)
4. P. Roberts. Industrial Brazing Practice.
Boca Raton. 2nd ed. Florida: CRC press; (2013)
[CROSSREF]
7. C. Peng, D. Zhu, K. Li, X. Du, F. Zhao, M. Wan, and Y. Tan, Research on a Low Melting Point Al-Si-Cu (Ni) Filler Metal for 6063 Aluminum Alloy Brazing,
Appl. Sci. 11(9) (2021)
https://doi.org/10.3390/app11094296
[CROSSREF]
10. A. Sharma, M. H. Roh, and J. P. Jung, Effect of La
2O
3 Nanoparticles on the Brazeability, Microstructure, and Mechanical Properties of Al-11Si-20Cu Alloy,
J. Mater. Eng. Perform. 25 (2016) 3538–3545.
https://doi.org/10.1007/s11665-016-2179-0
[CROSSREF]
11. K. Suzuki, M. Kagayama, and Y. Takeuchi, Eutectic phase equilibrium of Al-Si-Zn system and its applicability for lower temperature brazing,
J. Japan Inst. Light Met. 43 (1993) 533–538.
https://doi.org/10.2464/jilm.43.533
[CROSSREF]
17. M. Way, Ph D thesis, High entropy materials as brazing filler metals for thermoelectric devices, University of Sheffield, UK Sheffield. (2020)
22. D. U. Kim, C. Y. Kang, and W. J. Lee, The effect of grain boundary on the dissolution of base metal into insert metal during TLP bonding of Ni-base superalloys,
Met. Mater. 5(5) (1999) 477–484.
https://doi.org/10.1007/BF03026162
[CROSSREF]
23. American Welding Society. Brazing handbook. 5th ed, American Welding Society, Miami (FL). (2007)
30. A. T. Tan, A. W. Tan, and F. Yusof, Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn-Ag-Cu/Cu solder joint during different thermal conditions,
Sci. Technol. Adv. Mater. 16 3 (2015)
https://doi.org/10.1088/1468-6996/16/3/033505
[CROSSREF]
31. A. Sharma, M. Roh, D. Jung, and J. P. Jung, Effect of ZrO
2 nanoparticles on the microstructure of Al-Si-Cu filler for low-temperature Al brazing applications:Physical metallurgical and materials science,
Metall. Mater. Trans. 47(1) (2016) 510–521.
http://dx.doi.org/10.1007/s11661-015-3233-5
32. D. H. Jung, S. H. Rajendran, and J. P. Jung, Effect of ZrO₂Nanomaterials on Wettability and Interfacial Characteristics of Al-19Cu-11Si-2Sn Filler Metal for Low Temperature Al to Cu Dissimilar Brazing,
Nano- materials (Basel). 8(10) (2018) 784.
https://doi.org/10.3390/nano8100784. PMID:30282941;PMCID:PMC6215161
[CROSSREF] [PUBMED] [PMC]
33. H. Choi and X. Li, Refinement of primary Si and modification of eutectic Si for enhanced ductility of hypereutectic Al-20Si-4.5Cu alloy with addition of Al
2O
3 nanoparticles,
J. Mater. Sci. 47(7) (2012) 3096–3102.
https://doi.org/10.1016/j.msea.2012.01.131
[CROSSREF]
37. J. P. Jung, C. S. Kang, Y. J. Park, and S. H. Hang, Brazing technology and trend in Japan (1) - Aluminum, Brazing, J. Korean Weld. Join. Soc. 12(4) (1994)