0402칩의 무연솔더링 최적공정 연구 |
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Research of Optimum Reflow Process Condition for 0402 Electric Parts |
Junghwan Bang, Sehyung Lee, Yueseon Shin, Jeonghan Kim, Changwoo Lee |
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Abstract |
Reflow process conditions were investigated for 0402 electric parts with Sn-3.0Ag-0.5Cu solders. Circle hole shape metal mask with 100 m thickness showed excellent printability. Self alignment abilities were 71% for 1005 chips, 52% for 0603 chips, and 3% for 0402 chips. Average joining strengths were 1990 gf for 1005 chips, 867 gf for 0603 chips, and 525 gf for 0402 chips. As mis-mounting angle increased, joining strength decreased. Considering self-alignment ability, mounting angle had to be under 5° and contact area of the chips had to be over 40% for Pb-free soldering process for 0402 chips. |
Key Words:
Surface mount technology, Pb-free soldering, Joining strength, 0402 chips, Self alignment |
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