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Journal of KWJS. 2011;29(1):52-58. Published online March 4, 2011.
- Study of Metal(Au) Bump for Transverse Ultrasonic Bonding
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Myeong-Gu Ji, Chun-Sam Song, Joo-Hyun Kim, Jong-Hyeong Kim
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- Abstract
- In this paper, the direct bonding process between FPCB and HPCB was studied. By using an ultrasonic horn which is mounted on the ultrasonic bonding machine, it is alternatively possible to bond the gold pads attached on the FPCB and HPCB at room temperature without an adhesive like ACA or NCA. The process condition for obtaining more bonding strength than 0.6 Kgf, which is commercially required, was carried out as 40 ㎑ of frequency, 0.6 ㎫ of bonding pressure and 2 second of bonding time. The peel off test was performed for evaluating bonding strength which results in more than 0.8 Kgf.
Keywords :Ultrasonic bonding;Bump direct bonding;FPCB;Au to Au bonding;Display module bonding
