Volume 31 Issue 3

Special Issues Study on Joint of Micro Solder Bump for Application of Flexible Electronics

Yong-Ho Ko, Min-Su Kim, Taek-Soo Kim, Jung-Hwan Bang, Chang-Woo Lee

Journal of KWJS. 2013;31(3):4-10.

Special Issues Various Cu Filling Methods of TSV for Three Dimensional Packaging

Myong-Hoon Roh, Jun-Hyeong Lee, Wonjoong Kim, Jae Pil Jung, Hyeong-Tea Kim

Journal of KWJS. 2013;31(3):11-16.

Special Issues Mitigation Methods of Sn Whisker Growth on Pure Sn Plating

Keun-Soo Kim

Journal of KWJS. 2013;31(3):17-21.

Special Issues Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics

Won Sik Hong, Chul Min Oh

Journal of KWJS. 2013;31(3):22-30.

Research Papers Effects of Serrated Grain Boundary Structures on Boron Enrichment and Liquation Cracking Behavior in the Simulated Weld Heat-Affected Zone of a Ni-Based Superalloy

Hyun-Uk Hong, June-Woo Choi, Sang-Hyun Bae, Joong-Geun Yoon, In-Soo Kim, Baig-Gyu Choi, Dong-Jin Kim, Chang-Yong Jo

Journal of KWJS. 2013;31(3):31-38.

Research Papers Development of Push-pull Type Arc Welding Wire Feeder

Hyun-Jun Yoon, In-Sung Hwang, Dong-Cheol Kim, Moon-Jin Kang, Ki-Gab Choi

Journal of KWJS. 2013;31(3):39-43.

Research Papers Prediction of Arc Welding Quality through Artificial Neural Network

Jungho Cho

Journal of KWJS. 2013;31(3):44-48.

Research Papers Resistance Spot Welding Characteristics of Mg Alloy Using Process Tape

Dong-Soon Choi, Dong-Cheol Kim, Moon-Jin Kang

Journal of KWJS. 2013;31(3):49-53.

Research Papers Analytical Methodology Obtaining an Optimal Welding Sequence for Least Distortion of Welded Structure

Yunsok Ha

Journal of KWJS. 2013;31(3):54-59.

Research Papers Characteristics of Plasma Emission Signals in Fiber Laser Welding of API Steel (Ⅲ)

Chang-Je Lee, Jong-Do Kim, Yu-Chan Kim

Journal of KWJS. 2013;31(3):60-65.

Research Papers Effect of Coating Thickness on Microstructures and Tensile Properties in Yb:YAG Disk Laser Welds of Al-Si Coated Boron Steel

Wei-Ye Cao, Jong-Pan Kong, Yong-Nam Ahn, Cheol-Hee Kim, Chung-Yun Kang

Journal of KWJS. 2013;31(3):66-75.

Research Papers Effect of Bonding Condition on the Tensile Properties of Diffusion Bonded Haynes230

Gil-Mo Kang, Ae-Jeong Jeon, Hong-Kyu Kim, Sung-Suk Hong, Chung-Yun Kang

Journal of KWJS. 2013;31(3):76-83.

Research Papers Fabrication and Reliability Test of Device Embedded Flexible Module

Dae Gon Kim, Sung Taik Hong, Deok Heung Kim, Won Sik Hong, Chang-Woo Lee

Journal of KWJS. 2013;31(3):84-88.