3. Jeong-Won. Yoon, Jung-Hwan. Bang, Yong-Ho. Ko, Se-Hoon. Yoo, Jun-Ki. Kim, and Chang-Woo. Lee, Power Module Packaging Technology with Extended Reliability for Electric Vehicle Applications,
J. Microelectron. Packag. Soc. (2014) 21(4) 1–13.
https://doi.org/10.6117/kmeps.2014.21.4.001
[CROSSREF] [PDF]
5. Tuan-Yu. Hung, Li-Ling. Liao, C.C. Wang, W.H. Chi, and Kuo-Ning. Chiang, Life Prediction of High-Cycle Fatigue in Aluminum Bonding Wires Under Power Cycling Test,
IEEE Transactions on Device and Materials Reliability. (2014) 14(1) 484–492.
https://doi.org/10.1109/TDMR.2013.2288703
[CROSSREF]
7. Jun-Hwan. Bang, Dong-Yurl. Yu, Young-Ho. Ko, Jeong-Won. Yoon, and Chang-Woo. Lee, Lead-free Solder for Aut- omotive Electronics and Reliability Evaluation of Solder Joint,
Journal of Welding and Joining. (2016) 34(1) 26–34.
https://doi.org/10.5781/JWJ.2016.34.1.26
[CROSSREF] [PDF]
8. B. Ji, V. Pickert, W. Cao, and B. Zahawi, In situ diagnostics and prognostics of wire bonding faults in IGBT modules for electric vehicle drives,
IEEE Transactions on Power Electronics. (2013) 28(12) 5568–5577.
https://doi.org/10.1109/TPEL.2013.2251358
[CROSSREF]
10. Y. Yamada, Y. Takaku, Y. Yagi, I. Nakagawa, T. Atsumi, M. Shirai, I. Ohnuma, and K. Ishida,
Reliaibility of wire- bonding and solder joint for high temperature operation of power semiconductor device, Microelectronics Reliability. (2007) 47(12) 2147–2151.
https://doi.org/10.1016/j.microrel.2007.07.102
11. J. Biela, M. Schweizer, S. Waffler, and Johann W. Kolar, SiC versus Si-Evaluation of Potentials for Performance Improvement of Inverter and DC-DC Converter Systems by SiC Power Semiconductors,
IEEE Transactions on Industrial Electronics. (2011) 58(7) 2872–2882.
https://doi.org/10.1109/TIE.2010.2072896
[CROSSREF]
13. K. Hamada, Present status and future prospects for ele- ctronics in electric vehicles/hybrid electric vehicles and expectations for wide-bandgap semiconductor devices,
Phys. Stat. Sol. (b). (2008) 245(7) 1223–1231.
https://doi.org/10.1002/pssb.200844079
[CROSSREF]
14. Hangseok. Choi, Overview of silicon carbide power devices, Fairchild semiconductor. (2016)
15. JEDEC solid state Technology Association, JESD22- A103D “High Temperature Storage Life”. (2010)
17. Y.D. Han, H.Y. Jing, S.M.L. Nai, L.Y. Xu, C.M. Tan, and J. Wei, Interfacial reaction and shear strength of Ni- coated carbon nanotubes reinforced SneAgeCu solder joints during thermal cycling,
Intermetallics. (2012) 31 72–78.
https://doi.org/10.1016/j.intermet.2012.06.002
[CROSSREF]
19. P. Prangnell, F. Haddadi, and Y. C. Chen, Ultrasonic spot welding of aluminium to steel for automotive applications—microstructure and optimisation,
Materials Science and Technology. (2011) 27(3) 617–624.
https://doi.org/10.1179/026708310X520484
[CROSSREF]
21. A. Panteli, J.D. Robson, I. Brough, and P.B. Prangnell, The effect of high strain rate deformation on intermetallic reaction during ultrasonic welding aluminium to magnesium,
Materials Science & Engineering A. (2012) 556 31–42.
https://doi.org/10.1016/j.msea.2012.06.055
[CROSSREF]