:: Journal of Welding and Joining (JWJ) ::

Current Issue

Table of Contents | April, 2019 Vol. 37 No.2

In this issue:
▶ Research Paper
▶ Review Paper

Research Paper

The Effect of Environmental Test on the Shear Strength of the Ultrasonic bonded Cu Terminal for Power Module (Research Paper)

Kyung-Yeol Kim, Kyung Deuk Min, Yongil Kim, Jeong-Won Yoon, Seung-Boo Jung

Journal of Welding and Joining:1-6. Publication Date (Web): April 25, 2019

DOI: https://doi.org/10.5781/JWJ.2019.37.2.1

Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module (Research Paper)

Mi-Song Kim, Chulmin Oh, Won Sik Hong

Journal of Welding and Joining:15-20. Publication Date (Web): April 19, 2019

DOI: https://doi.org/10.5781/JWJ.2019.37.2.3

Effect of Air-HAST Conditions on Sn Whisker Growth (Research Paper)

Chulmin Oh, Sangjoo Oh, Dajung Kim, Won Sik Hong, Keun-Soo kIM

Journal of Welding and Joining:21-25. Publication Date (Web): April 22, 2019

DOI: https://doi.org/10.5781/JWJ.2019.37.2.4

Effect of Sintering Conditions on Microstructure and Mechanical Strength of Cu Micro-Particle Sintered Joints for High-Power Semiconductor Module Applications (Research Paper)

Byung-Suk Lee, Jong-Hoon Back, Jeong-Won Yoon

Journal of Welding and Joining:26-34. Publication Date (Web): April 22, 2019

DOI: https://doi.org/10.5781/JWJ.2019.37.2.5

Microtexture and Microstructural Evolution of Friction Stir Welded AA5052-H32 Joints (Research Paper)

Young-Bin Lim, Kwang-Jin Lee

Journal of Welding and Joining:35-40. Publication Date (Web): March 26, 2019

DOI: https://doi.org/10.5781/JWJ.2019.37.2.6

Optimization of PWHT on Dissimilar Friction Welding for Piping Material of A105 to A312 (Research Paper)

Yu-Sik Kong, Young Whan Park

Journal of Welding and Joining:60-65. Publication Date (Web): April 19, 2019

DOI: https://doi.org/10.5781/JWJ.2019.37.2.9

Statistical Analysis of Korean Welding Industry (IV) (Research Paper)

Seungjae Lee, Cheolhee Kim

Journal of Welding and Joining:66-69. Publication Date (Web): April 26, 2019

DOI: https://doi.org/10.5781/JWJ.2019.37.2.10

Review Paper

Epoxy Polymer Solder Pastes for Micro-Electronic Packaging Applications (Review Paper)

Ashutosh Sharma, Do Hyun Jung, Ju Seon Cheon, Jae Pil Jung

Journal of Welding and Joining:7-14. Publication Date (Web): April 30, 2019

DOI: https://doi.org/10.5781/JWJ.2019.37.2.2

A Review on Twin Tungsten Inert Gas Welding Process Accompanied by Hot Wire Pulsed Power Source (Review Paper)

Prassan Shah, Chetan Agrawal

Journal of Welding and Joining:41-51. Publication Date (Web): April 8, 2019

DOI: https://doi.org/10.5781/JWJ.2019.37.2.7

Ultrasonic and Laser Welding Technologies on Al/Cu Dissimilar Materials for the Lithium-Ion Battery Cell or Module Manufacturing (Review Paper)

Minjung Kang, Woo Seong Choi, Sanghoon Kang

Journal of Welding and Joining:52-59. Publication Date (Web): April 15, 2019

DOI: https://doi.org/10.5781/JWJ.2019.37.2.8

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