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JWJ > Volume 30(2); 2012 > Article
Journal of KWJS 2012 April;30(2) :65-69.
Published online May 16, 2012.
doi:https://doi.org/10.5781/KWJS.2012.30.2.65
Behavior of Vibration Fracture for Sn-Ag-Cu-X Solders by Soldering
Sanghun Jin, Namhyun Kang, Kyung-mox Cho, Changwoo Lee, Wonsik Hong




Correspondence:   Published online May 16, 2012
ABSTRACT
  Environmental and health concerns over the lead have led to investigation of the alternative Pb-free solders to replace commonly used Pb-Sn solders in microelectronic packaging application. The leading candidates for lead-free solder alloys are presently the near eutectic Sn-Ag-Cu alloys. Therefore, extensive studies on reliability related with the composition have been reported. However, the insufficient drop property of the near eutectic Sn-Ag-Cu alloys has demanded solder compositions of low Ag content. In addition, the solder interconnections in automobile applications like a smart box require significantly improved vibration resistance. Therefore, this study investigated the effect of alloying elements (Ag, Bi, In) on the vibration fatigue strength. The vibration fatigue was conducted in 10~1000㎐ frequency and 20Grms. The interface of the as-soldered cross section close to the Cu pad indicated the intermetallic compound (Cu6Sn5) regardless of solder composition. The type and thickness of IMC was not significantly changed after the vibration test. It indicates that no thermal activities occurred significantly during vibration. Furthermore, as a function of alloying composition, the vibration crack path was investigated with a focus on the IMCs. Vibration crack was initiated from the fillet surface of the heel for QFP parts and from the plating layer of chip parts. Regardless of the solder composition, the crack during a vibration test was propagated as same as that during a thermal fatigue test.
Keywords: Vibration;Fatigue;Fracture;Intermetallic compound;Pb-free solder
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