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JWJ > Volume 25(3); 2007 > Article
Journal of KWJS 2007 June;25(3) :57-63.
Published online July 19, 2007.
Electrochemical Migration Characteristics of Sn-3.0Ag-0.5Cu Solder Alloy in NaBr and NaF Solutions
Ja-Young Jung, Eun-Jung Jang, Young-Ran Yoo, Shin-Bok Lee, Young-Sik Kim, Young-Chang Joo, Tai-Joo Chung, Kyu-Hwan Lee, Young-Bae Park








Correspondence:   Published online July 19, 2007
ABSTRACT
  Electrochemical migration characteristics of Pb-free solder alloys are quantitatively correlated with corrosion characteristics in harsh environment conditions. In-situ water drop test and corrosion resistance test for Sn-3.0Ag-0.5Cu solder alloys were carried out in NaBr and NaF solutions to obtain the electrochemical migration lifetime and pitting potential, respectively. Sn-3.0Ag-0.5Cu solder alloy shows similar ionization and electrochemical migration behavior with pure Sn because of Ag and Cu do not migrate due to the formation of resistant intermetallic compounds inside solder itself. Electrochemical migration lifetime in NaBr is longer than in NaF, which seems to be closely related to higher pitting potential in NaBr than NaF solution. Therefore, it was revealed that electrochemical migration lifetime of Sn-3.0Ag-0.5Cu solder alloys showed good correlation to the corrosion resistance, and also the initial ionization step at anode side is believed to be the rate-determining step during electrochemical migration of Pb-free solders in these environments.
Keywords: Electrochemical migration lifetime;SnAgCu;NaBr;NaF;Polarization;Corrosion
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