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89 Growth Behavior of Intermetallic Compounds in Various Solder Joints Induced by Electromigration   
Sujong Kim, Wonsik Hong, Hyunbin Nam, Namhyun Kang
Journal of Welding and Joining:89-102.  Publication Date (Web): February 26, 2021
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44 Verification Guideline of Pb-free Solder Joint Reliability for Military Electronics
WonSik Hong, Gi-Young Goo, UnHee Hwang
Journal of Welding and Joining:44-50.  Publication Date (Web): July 18, 2012
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65 Behavior of Vibration Fracture for Sn-Ag-Cu-X Solders by Soldering
Sanghun Jin, Namhyun Kang, Kyung-mox Cho, Changwoo Lee, Wonsik Hong
Journal of Welding and Joining:65-69.  Publication Date (Web): May 16, 2012
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11 Relaibility Validation Methodology for Implementation Pb-free Solder to Military Electronics
Jaesseong Jeong, Chulmin Oh, Gi-Young Goo, Young-Ho Yoon, UnHee Hwang, WonSik Hong
Journal of Welding and Joining:11-20.  Publication Date (Web): September 12, 2011
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3 The Growth Mechanism and Mitigation Method of Sn Whiskers
Chulmin Oh, JaeSung Jung, ki-Young Ku, Young-Ho Yoon, UnHee Hwang, WonSik Hong
Journal of Welding and Joining:3-10.  Publication Date (Web): September 12, 2011
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10 PoF Based Accelerated Life Prediction with 3 Dimensional Packaging Technology Development
WonSik Hong, Chul-Min Oh
Journal of Welding and Joining:10-16.  Publication Date (Web): July 6, 2009
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