Cu Filling into TSV and Si Dice Stacking for 3 Dimension Packaging

Roh, Myong-Hoon; Park, Sang-Yoon; Kim, Wonjoong; Jung, Jae-Pil

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Journal of KWJS 2011;29(3):39-44.
Published online July 7, 2011.

3차원 실장을 위한 TSV의 Cu 충전 및 Si 칩 적층 기술

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Cu Filling into TSV and Si Dice Stacking for 3 Dimension Packaging

Myong-Hoon Roh, Sang-Yoon Park, Wonjoong Kim, Jae-Pil Jung

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