Through Silicon Via Filling and Fine Pitch Joining Technology for 3D Electronic Package

Yoo, Sehoon; Lee, Chang-Woo

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Journal of KWJS 2009;27(3):17-22.
Published online July 6, 2009.

3D 전자패키징용 관통실리콘비아의 충진 및 미세피치 접합기술

Through Silicon Via Filling and Fine Pitch Joining Technology for 3D Electronic Package

Sehoon Yoo, Chang-Woo Lee

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