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2032081
Laser-Assisted Bonding (LAB), Its Bonding Materials, and Their Applications
Kwang-Seong Choi, Jiho Joo, Ki-seok Jang et al.
J Weld Join. 2020;38(2):138-144.   Published online April 29, 2020
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2032078
Effect of Underfill and Cornerfill on the 3-Point Bending Reliability of BGA Package Under Thermal Shock Test
Kyung-Yeol Kim, Haksan Jeong, Sang-Woo Kim, Jae-Oh Bang, Seung-Boo Jung
J Weld Join. 2020;38(2):145-151.   Published online April 22, 2020
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Investigations of Material Properties of Underfill Material for Mechanical Reliability Improvement of Electronic Devices
Byung-Seung Yim, Jin-Nam Kim, Jong-Min Kim
J Weld Join. 2019;37(5):477-481.   Published online September 19, 2019
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Flow Characteristics and Filling Time Estimation for Underfill Process
Hyung-Sub Sim, Seong-Hyuk Lee, Jong-Min Kim, Young-Eui Shin
J Weld Join. 2007;25(3):45-50.   Published online July 19, 2007
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Evaluation of Thermal Property and Fluidity with Underfill for BGA Package
Bo-In Noh, Bo-Young Lee, Soo-Jung Kim, Seung-Boo Jung
J Weld Join. 2006;24(2):57-63.   Published online July 18, 2006
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