| BGA 패키지를 위한 언더필의 열적 특성과 유동성에 관한 연구 |
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| Evaluation of Thermal Property and Fluidity with Underfill for BGA Package |
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Bo-In Noh, Bo-Young Lee, Soo-Jung Kim, Seung-Boo Jung |
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| Abstract |
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In this study, the curing kinetics and thermal degradation of underfill were investigated using differential scanning calorimetry (DSC) and thermo gravimetry analysis (TGA). The mechanical and thermal properties of underfill were characterized using dynamic mechanical analysis (DMA) and thermo-mechanical analysis (TMA). Also, we presented on underfill dispensing process using Prostar tool. The non-isothermal DSC scans at various heating rates, the exothermic reaction peak became narrower with increasing the heating rate. The thermal degradation of underfill was composed of two processes, which involved chemical reactions between the degrading polymer and oxygen from the air atmosphere. The results of fluidity phenomena were simulated using Star CD program, the fluidity of the underfills with lower viscosity was faster. |
| Key Words:
BGA package, Underfill, Glass transition temperature, Viscosity |
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