Advanced Search  
JWJ > Volume 24(2); 2006 > Article
Journal of KWJS 2006 April;24(2) :57-63.
Published online July 18, 2006.
Evaluation of Thermal Property and Fluidity with Underfill for BGA Package
Bo-In Noh, Bo-Young Lee, Soo-Jung Kim, Seung-Boo Jung



Correspondence:   Published online July 18, 2006
ABSTRACT
  In this study, the curing kinetics and thermal degradation of underfill were investigated using differential scanning calorimetry (DSC) and thermo gravimetry analysis (TGA). The mechanical and thermal properties of underfill were characterized using dynamic mechanical analysis (DMA) and thermo-mechanical analysis (TMA). Also, we presented on underfill dispensing process using Prostar tool. The non-isothermal DSC scans at various heating rates, the exothermic reaction peak became narrower with increasing the heating rate. The thermal degradation of underfill was composed of two processes, which involved chemical reactions between the degrading polymer and oxygen from the air atmosphere. The results of fluidity phenomena were simulated using Star CD program, the fluidity of the underfills with lower viscosity was faster.
Keywords: BGA package;Underfill;Glass transition temperature;Viscosity
TOOLS
PDF Links  PDF Links
Full text via DOI  Full text via DOI
Download Citation  Download Citation
CrossRef TDM  CrossRef TDM
  E-Mail
Share:      
METRICS
813
View
0
Download
Related article
Evaluation of Material Degradation and Life Prediction for High Temperature Structures   1995 June;13(2)
Evaluation of Material Degradation and Life Prediction for High Temperature Structures   1995 June;13(2)
e-sciencecentral
Register for e-submission
Register here to access the e-submission system of Journal of KWJS for authors and reviewers.
Manuscript Submission
To submit a manuscript, please visit the Journal of KWJS e-submission management system at http://submit.e-jwj.org, read the Instructions for Authors, and log into the Journal of KWJS e-submission system. For assistance with manuscript submission, please contact: koweld@kwjs.or.kr.
Free archive
Anyone may access any past or current articles without logging in.
Editorial Office
The Korea Science and Technology Building, New B/D, Room 503
Teheran-ro 7-gil, 22(635-4, Yeoksam-Dong), Gangnam-gu, Seoul 06130, Korea
TEL : +82-2-538-6511    FAX : +82-2-538-6510   E-mail: koweld@kwjs.or.kr
Browse Articles |  Current Issue |  For Authors and Reviewers |  About
Copyright© by The Korean Welding and Joining Society. All right reserved.