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7 High-speed Sintering of Ag-based Composite Ink by Nano-soldering   
Woo Lim Choi, Jong-Hyun Lee
Journal of Welding and Joining:7-13.  Publication Date (Web): April 11, 2018
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99 Improvement of Solder Joint Strength in SAC 305 Solder Ball to ENIG Substrate Using LF Hydrogen Radical Treatment
Ah-reum Lee, Seung-jae Jo, Jai-hyun Park, Chung-yun Kang
Journal of Welding and Joining:99-106.  Publication Date (Web): March 4, 2011
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85 Research of Optimum Reflow Process Condition for 0402 Electric Parts
Junghwan Bang, Sehyung Lee, Yueseon Shin, Jeonghan Kim, Changwoo Lee
Journal of Welding and Joining:85-89.  Publication Date (Web): March 12, 2009
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30 A Study on the Optimization of IR Laser Flip-chip Bonding Process Using Taguchi Methods
Chun-Sam Song, Hyun-Sik Ji, Joohan Kim, Jong-Hyeong Kim, Hyo-Sok Ahn
Journal of Welding and Joining:30-36.  Publication Date (Web): July 31, 2008
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