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JWJ > Volume 27(1); 2009 > Article
Journal of KWJS 2009 February;27(1) :85-89.
Published online March 12, 2009.
Research of Optimum Reflow Process Condition for 0402 Electric Parts
Junghwan Bang, Sehyung Lee, Yueseon Shin, Jeonghan Kim, Changwoo Lee




Correspondence:   Published online March 12, 2009
ABSTRACT
  Reflow process conditions were investigated for 0402 electric parts with Sn-3.0Ag-0.5Cu solders. Circle hole shape metal mask with 100 m thickness showed excellent printability. Self alignment abilities were 71% for 1005 chips, 52% for 0603 chips, and 3% for 0402 chips. Average joining strengths were 1990 gf for 1005 chips, 867 gf for 0603 chips, and 525 gf for 0402 chips. As mis-mounting angle increased, joining strength decreased. Considering self-alignment ability, mounting angle had to be under 5° and contact area of the chips had to be over 40% for Pb-free soldering process for 0402 chips.
Keywords: Surface mount technology;Pb-free soldering;Joining strength;0402 chips;Self alignment
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