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Journal of KWJS 2009;27(1):85-89.
Published online March 12, 2009.
0402칩의 무연솔더링 최적공정 연구
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Research of Optimum Reflow Process Condition for 0402 Electric Parts
Junghwan Bang, Sehyung Lee, Yueseon Shin, Jeonghan Kim, Changwoo Lee
Abstract
  Reflow process conditions were investigated for 0402 electric parts with Sn-3.0Ag-0.5Cu solders. Circle hole shape metal mask with 100 m thickness showed excellent printability. Self alignment abilities were 71% for 1005 chips, 52% for 0603 chips, and 3% for 0402 chips. Average joining strengths were 1990 gf for 1005 chips, 867 gf for 0603 chips, and 525 gf for 0402 chips. As mis-mounting angle increased, joining strength decreased. Considering self-alignment ability, mounting angle had to be under 5° and contact area of the chips had to be over 40% for Pb-free soldering process for 0402 chips.
Key Words: Surface mount technology, Pb-free soldering, Joining strength, 0402 chips, Self alignment
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