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JWJ > Volume 26(1); 2008 > Article
Journal of KWJS 2008 February;26(1) :31-36.
Published online March 21, 2008.
Ultrasonic Bonding Technology for Flip Chip Packaging
Ja-Myeong Koo, Jong-Woong Kim, Jeong-Won Yoon, Bo-In Noh, Chang-Yong Lee, Jeong-Hoon Moon, Choong-Don Yoo, Seung-Boo Jung







Correspondence:   Published online March 21, 2008
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