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Journal of KWJS 2008;26(1):31-36.
Published online March 21, 2008.
플립칩 패키징을 위한 초음파 접합 기술
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Ultrasonic Bonding Technology for Flip Chip Packaging
Ja-Myeong Koo, Jong-Woong Kim, Jeong-Won Yoon, Bo-In Noh, Chang-Yong Lee, Jeong-Hoon Moon, Choong-Don Yoo, Seung-Boo Jung
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